m →790X: Removed last row pertaining to TDA information, as the item/product is outdated and no longer even maintained by dev-/manufacturer (AMD .inc in this case)
The existence of the chipsets was proven in October 2006 through two hardware websites in Chile<ref>[http://www.reghardware.co.uk/2006/10/06/ati_roadmap_2007/ ATI targets next-gen Athlon 64 FX with four-GPU chipset?]</ref> and Spain<ref>[http://www.madboxpc.com/contenido.php?id=3083 MadBoxPC reporting "ATI chipset update"] {{webarchive |url=https://web.archive.org/web/20061126105620/http://www.madboxpc.com/contenido.php?id=3083 |date=November 26, 2006}}</ref> which posted the leaked slides of an ATI internal event, "ATI chipset update". In the slides, ATI has shown a series of RD700 series chipset logics codenamed ''RD790'', ''RX790'', ''RS780'' and ''RS740'' respectively. A ''SB700'' [[southbridge (computing)|southbridge]] was also mentioned in the event. The 790X (codename ''RD780'') chipset was spotted in Computex 2007, exhibited by [[ASUSTek|ASUS]]. The ''RS780D'' was first reported by HKEPC<ref name="HKEPC4" /> while the ''RX780H'' was first seen on ECS internal presentations.<ref name="PCW496">{{cite news|title=RS780 and MCP78 to be released soon. ECS talks about Black Series Motherboards|url=|work=|publisher=PCweekly|date=2008-01-17|location=Hong Kong|language=zh}}</ref>
The existence of the chipsets was proven in October 2006 through two hardware websites in Chile<ref>[http://www.reghardware.co.uk/2006/10/06/ati_roadmap_2007/ ATI targets next-gen Athlon 64 FX with four-GPU chipset?]</ref> and Spain<ref>[http://www.madboxpc.com/contenido.php?id=3083 MadBoxPC reporting "ATI chipset update"] {{webarchive |url=https://web.archive.org/web/20061126105620/http://www.madboxpc.com/contenido.php?id=3083 |date=November 26, 2006}}</ref> which posted the leaked slides of an ATI internal event, "ATI chipset update". In the slides, ATI has shown a series of RD700 series chipset logics codenamed ''RD790'', ''RX790'', ''RS780'' and ''RS740'' respectively. A ''SB700'' [[southbridge (computing)|southbridge]] was also mentioned in the event. The 790X (codename ''RD780'') chipset was spotted in Computex 2007, exhibited by [[ASUSTek|ASUS]]. The ''RS780D'' was first reported by HKEPC<ref name="HKEPC4" /> while the ''RX780H'' was first seen on ECS internal presentations.<ref name="PCW496">{{cite news|title=RS780 and MCP78 to be released soon. ECS talks about Black Series Motherboards|publisher=PCweekly|date=2008-01-17|location=Hong Kong|language=zh}}</ref>
After the acquisition of ATI Technologies, AMD started to participate in the development of the chipset series. And as a result, the first performance and enthusiast segment chipsets products under the AMD brand, the 790FX, 790X and 770 chipsets were launched on November 19, 2007 as part of the ''Spider'' codenamed desktop performance platform. The 780 chipset series, first launched in [[China]] on January 23, 2008, and released worldwide on March 5, 2008 during [[CeBIT]] 2008,<ref>[http://www.digitimes.com/mobos/a20080124PD200.html DigiTimes report]. Retrieved January 25, 2008.</ref> mobile chipsets (M740G, M780G and M780T chipsets) were released on June 4, 2008 during [[Computex]] 2008 as part of the [[AMD Puma|Puma mobile platform]] and the 790GX chipset was released on August 6, 2008, while some other members released at a later date in 2008. The 785G was announced on August 4, 2009.
After the acquisition of ATI Technologies, AMD started to participate in the development of the chipset series. And as a result, the first performance and enthusiast segment chipsets products under the AMD brand, the 790FX, 790X and 770 chipsets were launched on November 19, 2007 as part of the ''Spider'' codenamed desktop performance platform. The 780 chipset series, first launched in [[China]] on January 23, 2008, and released worldwide on March 5, 2008 during [[CeBIT]] 2008,<ref>[http://www.digitimes.com/mobos/a20080124PD200.html DigiTimes report]. Retrieved January 25, 2008.</ref> mobile chipsets (M740G, M780G and M780T chipsets) were released on June 4, 2008 during [[Computex]] 2008 as part of the [[AMD Puma|Puma mobile platform]] and the 790GX chipset was released on August 6, 2008, while some other members released at a later date in 2008. The 785G was announced on August 4, 2009.
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===790FX===
===790FX===
{{Update|type=section|date=November 2010}}
{{Update|type=section|date=November 2010}}
*Codenamed ''RD790'', final name revealed to be "AMD 790FX chipset"<ref>[http://www.fudzilla.com/index.php?option=com_content&task=view&id=3480&Itemid=1 Fudzilla report]. Retrieved October 8, 2007. {{webarchive |url=https://web.archive.org/web/20071011013824/http://www.fudzilla.com/index.php?option=com_content&task=view&id=3480&Itemid=1 |date=October 11, 2007}}</ref>
*Codenamed ''RD790'', final name revealed to be "AMD 790FX chipset"<ref>[http://www.fudzilla.com/index.php?option=com_content&task=view&id=3480&Itemid=1 Fudzilla report]. Retrieved October 8, 2007. {{webarchive |url=https://web.archive.org/web/20071011013824/http://www.fudzilla.com/index.php?option=com_content&task=view&id=3480&Itemid=1 |date=October 11, 2007}}</ref>
*single AMD processor configuration<ref>{{cite web |url=http://www.theinquirer.net/inquirer/news/1029354/amd-no-longer-fasn8ted |title=AMD no longer FASN8ted |work=[[The Inquirer]] |archive-url=https://web.archive.org/web/20090808084055/http://www.theinquirer.net/inquirer/news/1029354/amd-no-longer-fasn8ted |archive-date=2009-08-08 |url-status=dead |access-date=2021-07-09}}</ref>
*Four physical PCIe 2.0 x16 slots @ x8 or two physical PCIe 2.0 x16 slots, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots,<ref name="Chile2">{{esicon}} [http://www.chilehardware.com/foro/daamit-rd790-t53927.html?t=53927 ChileHardware discussion thread] {{webarchive|url=https://web.archive.org/web/20070928121926/http://www.chilehardware.com/foro/daamit-rd790-t53927.html?t=53927 |date=2007-09-28}}</ref> the chipset provides a total of 38 PCIe 2.0 lanes and 4 PCIe 1.1 for [[List of AMD chipsets#A-Link Express II|A-Link Express II]] solely in the Northbridge
*Four physical PCIe 2.0 x16 slots @ x8 or two physical PCIe 2.0 x16 slots, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots,<ref name="Chile2">{{in lang|es}} [http://www.chilehardware.com/foro/daamit-rd790-t53927.html?t=53927 ChileHardware discussion thread] {{webarchive|url=https://web.archive.org/web/20070928121926/http://www.chilehardware.com/foro/daamit-rd790-t53927.html?t=53927 |date=2007-09-28}}</ref> the chipset provides a total of 38 PCIe 2.0 lanes and 4 PCIe 1.1 for [[List of AMD chipsets#A-Link Express II|A-Link Express II]] solely in the Northbridge
*[[HyperTransport]] 3.0 with support for [[Hypertransport#Add-on card connector (HTX and HTX3)|HTX]] slots<ref name="Chile2" /> and [[PCI Express]] 2.0
*[[HyperTransport]] 3.0 with support for [[Hypertransport#Add-on card connector (HTX and HTX3)|HTX]] slots<ref name="Chile2" /> and [[PCI Express]] 2.0
**65 nm [[CMOS]] fabrication process manufactured by [[TSMC]]
**65 nm [[CMOS]] fabrication process manufactured by [[TSMC]]
*Extreme overclocking, reported to have achieved about 420 MHz bus for overclocking an [[Athlon 64 FX|Athlon 64 FX-62]] processor, from originally 200 MHz.
*Extreme overclocking, reported to have achieved about 420 MHz bus for overclocking an [[Athlon 64 FX|Athlon 64 FX-62]] processor, from originally 200 MHz.
*Optional discrete chipset cache memory of at least 16KB to reduce latencies and increase bandwidth<ref name="Chile2"/>
*Optional discrete chipset cache memory of at least 16 KB to reduce latencies and increase bandwidth<ref name="Chile2"/>
*Supports Dual [[Gigabit Ethernet]], and teaming option<ref name="Chile2"/>
*Supports Dual [[Gigabit Ethernet]], and teaming option<ref name="Chile2"/>
*Reference board codenamed "''Wahoo''"<ref name="TG1">[http://www.tgdaily.com/content/view/31991/135/ TG Daily report] {{webarchive|url=https://web.archive.org/web/20070513033712/http://www.tgdaily.com/content/view/31991/135/ |date=2007-05-13}}. Retrieved July 27, 2007.</ref> for dual-processor system reference design board with three physical PCI-E x16 slots, and "''HammerHead''" for single-socket system reference design board with four physical PCI-E x16 slots, also notable was the reference boards includes two [[AT Attachment|ATA]] ports and only four [[SATA]] 3.0Gbit/s ports (as being paired with SB600 southbridge).
*Reference board codenamed "''Wahoo''"<ref name="TG1">[http://www.tgdaily.com/content/view/31991/135/ TG Daily report] {{webarchive|url=https://web.archive.org/web/20070513033712/http://www.tgdaily.com/content/view/31991/135/ |date=2007-05-13}}. Retrieved July 27, 2007.</ref> for dual-processor system reference design board with three physical PCI-E x16 slots, and "''HammerHead''" for single-socket system reference design board with four physical PCI-E x16 slots, also notable was the reference boards includes two [[AT Attachment|ATA]] ports and only four [[SATA]] 3.0 Gbit/s ports (as being paired with SB600 southbridge).
*Will pair with [[RD700 chipset series#SB750|SB750]] [[southbridge (computing)|southbridge]] with support up to six SATA ports and enhanced [[Phenom (processor)|Phenom processors]] overclocking via ACC functionality, and will later support [[Socket AM3]] with [[DDR3 SDRAM]] support in the first quarter of 2009.
*Will pair with [[RD700 chipset series#SB750|SB750]] [[southbridge (computing)|southbridge]] with support up to six SATA ports and enhanced [[Phenom (processor)|Phenom processors]] overclocking via ACC functionality, and will later support [[Socket AM3]] with [[DDR3 SDRAM]] support in the first quarter of 2009.
*Enthusiast discrete multi-graphics segment
*Enthusiast discrete multi-graphics segment
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===790X===
===790X===
*Codenamed ''RD780'', final name revealed to be "AMD 790X chipset"<ref>[http://www.tcmagazine.com/comments.php?shownews=16444&catid=2 TechConnect Magazine report]. Retrieved October 17, 2007. {{webarchive |url=https://web.archive.org/web/20081216114252/http://www.tcmagazine.com/comments.php?shownews=16444&catid=2 |date=December 16, 2008}}</ref>
*Codenamed ''RD780'', final name revealed to be "AMD 790X chipset"<ref>[http://www.tcmagazine.com/comments.php?shownews=16444&catid=2 TechConnect Magazine report]. Retrieved October 17, 2007. {{webarchive |url=https://web.archive.org/web/20081216114252/http://www.tcmagazine.com/comments.php?shownews=16444&catid=2 |date=December 16, 2008}}</ref>
*Single AMD processor configuration
*Single AMD processor configuration
*One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
**65 nm [[CMOS]] fabrication process manufactured by [[TSMC]]
**65 nm [[CMOS]] fabrication process manufactured by [[TSMC]]
*Mobile version (codenamed ''RD780M'') planned, supporting CrossFire for two AXIOM/MXM discrete mobile GPUs<ref>[http://www.theinquirer.net/en/inquirer/news/2007/06/05/amd-to-bring-in-55-nanometre-dx101-gpus The Inquirer report] {{webarchive |url=https://web.archive.org/web/20080129123653/http://www.theinquirer.net/en/inquirer/news/2007/06/05/amd-to-bring-in-55-nanometre-dx101-gpus |date=January 29, 2008 }}. Retrieved January 31, 2008.</ref>
*Mobile version (codenamed ''RD780M'') planned, supporting CrossFire for two AXIOM/MXM discrete mobile GPUs<ref>{{cite web |url=http://www.theinquirer.net/en/inquirer/news/2007/06/05/amd-to-bring-in-55-nanometre-dx101-gpus |title=AMD to bring in 55 nanometre, DX10.1 GPUs |work=[[The Inquirer]] |archive-url=https://web.archive.org/web/20080129123653/http://www.theinquirer.net/en/inquirer/news/2007/06/05/amd-to-bring-in-55-nanometre-dx101-gpus |archive-date=January 29, 2008 |url-status=dead |access-date=2021-07-09}}</ref>
*Can pair with [[RD700 chipset series#SB750|SB750]] [[southbridge (computing)|southbridge]] with support up to six SATA ports and enhanced [[Phenom (processor)|Phenom processors]] overclocking via ACC functionality.
*Can pair with [[RD700 chipset series#SB750|SB750]] [[southbridge (computing)|southbridge]] with support up to six SATA ports and enhanced [[Phenom (processor)|Phenom processors]] overclocking via ACC functionality.
*Supports [[Socket AM3]] with [[DDR3 SDRAM]] depending on motherboard BIOS
*Supports [[Socket AM3]] with [[DDR3 SDRAM]] depending on motherboard BIOS
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===790GX===
===790GX===
[[File:A790GXH-128M-Motherboard.jpg|thumb|right|A motherboard using the 790GX Northbridge chipset]]
[[File:A790GXH-128M-Motherboard.jpg|thumb|right|A motherboard using the 790GX Northbridge chipset]]
*Codenamed ''RS780D'',<ref name="HKEPC4" /> final name seen on internal AMD presentation<ref name="PCW497">{{cite news|title=First look at Hybrid CrossFire. AMD RS780+SB700 enters the stage|url=|work=|publisher=PCWeekly|date=2008-01-24|location=Hong Kong|language=zh}}</ref>
*Codenamed ''RS780D'',<ref name="HKEPC4" /> final name seen on internal AMD presentation<ref name="PCW497">{{cite news|title=First look at Hybrid CrossFire. AMD RS780+SB700 enters the stage|publisher=PCWeekly|date=2008-01-24|location=Hong Kong|language=zh}}</ref>
*Single AMD processor configuration
*Single AMD processor configuration
*One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*[[AMD 700 chipset series#Integrated graphics|Integrated graphics]]: Radeon HD 3300<ref name="Chile3">{{esicon}} [http://www.chilehardware.com/foro/ati-radeon-hd3100-t132327.html ChileHardware report] {{webarchive|url=https://web.archive.org/web/20071227133021/http://www.chilehardware.com/foro/ati-radeon-hd3100-t132327.html |date=2007-12-27}}. Retrieved January 17, 2008.</ref>
*[[#Integrated graphics|Integrated graphics]]: Radeon HD 3300<ref name="Chile3">{{in lang|es}} [http://www.chilehardware.com/foro/ati-radeon-hd3100-t132327.html ChileHardware report] {{webarchive|url=https://web.archive.org/web/20071227133021/http://www.chilehardware.com/foro/ati-radeon-hd3100-t132327.html |date=2007-12-27}}. Retrieved January 17, 2008.</ref>
*One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*[[AMD 700 chipset series#Integrated graphics|Integrated graphics]]: Radeon HD 4200
*[[#Integrated graphics|Integrated graphics]]: Radeon HD 4200
**[[AMD 700 chipset series#ATI Hybrid Graphics|ATI Hybrid Graphics and PowerXpress]]
**[[#ATI Hybrid Graphics|ATI Hybrid Graphics and PowerXpress]]
**Side-port memory as local [[frame buffer]], supporting [[DDR2 SDRAM|DDR2]] and { [[GDDR3]] chips {{citation needed|date=June 2015}} }
**Side-port memory as local [[frame buffer]], supporting [[DDR2 SDRAM|DDR2]] and [[DDR3 SDRAM|DDR3]]
**[[Unified Video Decoder|UVD 2]]
**[[Unified Video Decoder|UVD 2.0]]
**[[AMD FireStream#Software Development Kit|ATI Stream]] capabilities
**[[AMD FireStream#Software Development Kit|ATI Stream]] capabilities
*No 7.1-channel LPCM support<ref name="anandtech785g-correction">[http://anandtech.com/weblog/showpost.aspx?i=629 AnandTech: AMD 785G Update — Multi-Channel LPCM is not Available]</ref>
*No 7.1-channel LPCM support<ref name="anandtech785g-correction">[http://anandtech.com/weblog/showpost.aspx?i=629 AnandTech: AMD 785G Update — Multi-Channel LPCM is not Available]</ref>
*One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*[[AMD 700 chipset series#Integrated graphics|Integrated graphics]]: Radeon HD 4200
*[[#Integrated graphics|Integrated graphics]]: Radeon HD 4200
**[[AMD 700 chipset series#ATI Hybrid Graphics|ATI Hybrid Graphics and PowerXpress]]
**[[#ATI Hybrid Graphics|ATI Hybrid Graphics and PowerXpress]]
**Side-port memory as local [[frame buffer]], supporting [[DDR2 SDRAM|DDR2]] and [[GDDR3]]
**Side-port memory as local [[frame buffer]], supporting [[DDR2 SDRAM|DDR2]] and [[GDDR3]]
*One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*Mobile version (M780G, codenamed ''RS780M''/M780V, codenamed ''RS780MC'') demonstrated in May 2007,<ref>[http://www.bit-tech.net/hardware/2007/05/18/amd_mobile_griffin_and_puma/1 Bit-Tech report]</ref> and will be available during second or third quarter (Q2-Q3) 2008,<ref>[http://news.cnet.com/AMDs+new+Puma+stalking+Intels+Centrino/2100-1006_3-6184712.html?part=rss&tag=2547-1_3-0-5&subj=news C|Net Interview with AMD Fellow Maurice Steinman]</ref> with the implementation of [[ATI Hybrid Graphics#PowerXpress|PowerXpress]] technology, providing one [[PCI-E]] slot for [[Advanced eXpress I/O Module|AXIOM]]/[[Mobile PCI Express Module|MXM]] modules<ref>[http://theinquirer.net/?article=41677 The Inquirer report]. Retrieved August 13, 2007.</ref> and [[AMD 700 chipset series#HyperFlash|HyperFlash]]<ref>[http://www.reghardware.co.uk/2007/05/18/amd_details_m780_chipset/ RegHardware report]</ref><ref>[http://www.reghardware.co.uk/2007/05/18/amd_readies_hyperflash RegHardware report]</ref> support for the [[AMD Puma|''Puma'' platform]]
*Mobile version (M780G, codenamed ''RS780M''/M780V, codenamed ''RS780MC'') demonstrated in May 2007,<ref>[http://www.bit-tech.net/hardware/2007/05/18/amd_mobile_griffin_and_puma/1 Bit-Tech report]</ref> and will be available during second or third quarter (Q2-Q3) 2008,<ref>[http://news.cnet.com/AMDs+new+Puma+stalking+Intels+Centrino/2100-1006_3-6184712.html?part=rss&tag=2547-1_3-0-5&subj=news C|Net Interview with AMD Fellow Maurice Steinman]</ref> with the implementation of [[ATI Hybrid Graphics#PowerXpress|PowerXpress]] technology, providing one [[PCI-E]] slot for [[Advanced eXpress I/O Module|AXIOM]]/[[Mobile PCI Express Module|MXM]] modules<ref>[https://web.archive.org/web/20160118070549/http://www.theinquirer.net/?article=41677 The Inquirer report]. Retrieved August 13, 2007.</ref> and [[#HyperFlash|HyperFlash]]<ref>[http://www.reghardware.co.uk/2007/05/18/amd_details_m780_chipset/ RegHardware report]</ref><ref>[http://www.reghardware.co.uk/2007/05/18/amd_readies_hyperflash RegHardware report]</ref> support for the [[AMD Puma|''Puma'' platform]]
*Mainstream hybrid graphics (DirectX 10 IGP) segment (780G), value and commercial DirectX 10 IGP segment (780V)
*Mainstream hybrid graphics (DirectX 10 IGP) segment (780G), value and commercial DirectX 10 IGP segment (780V)
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*Single AMD processor configuration
*Single AMD processor configuration
*One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*[[AMD 700 chipset series#Integrated graphics|Integrated graphics]]: Radeon HD 3200
*[[#Integrated graphics|Integrated graphics]]: Radeon HD 3200
**205 million transistors<ref name="Fudzilla report"/>
**205 million transistors<ref name="Fudzilla report"/>
**[[AMD 700 chipset series#ATI Hybrid Graphics|ATI Hybrid Graphics and PowerXpress]]
**[[#ATI Hybrid Graphics|ATI Hybrid Graphics and PowerXpress]]
**Side-port memory as local [[frame buffer]], supporting [[DDR2 SDRAM|DDR2]] and [[GDDR3]] chips up to 128MB
**Side-port memory as local [[frame buffer]], supporting [[DDR2 SDRAM|DDR2]] and [[GDDR3]] chips up to 128 MB
**[[ATI PowerPlay|ATI PowerPlay technology]]
**[[ATI PowerPlay|ATI PowerPlay technology]]
**[[Unified Video Decoder|UVD]] 2.0
**[[Unified Video Decoder|UVD]]+
*One x16 or two x8 PCI-E x16 slot (physical x16 slot)
*One x16 or two x8 PCI-E x16 slot (physical x16 slot)
*Codenamed ''RX780'',<ref>{{Cite web |url=http://dailytech.com/Partners+Showcase+AMD+RD790+Motherboards/article7580.htm |title=DailyTech report |access-date=2007-06-07 |archive-url=https://web.archive.org/web/20070609171028/http://dailytech.com/Partners+Showcase+AMD+RD790+Motherboards/article7580.htm |archive-date=2007-06-09 |dead-url=yes |df= }}</ref> final product name revealed by [[Elitegroup Computer Systems|ECS]]<ref>[http://www.ecs.com.tw/ECSWebSite/Products/ProductsDetail.aspx?detailid=844&DetailName=Specification&MenuID=46&LanID=8 ECS products page] {{webarchive |url=https://web.archive.org/web/20071012015135/http://www.ecs.com.tw/ECSWebSite/Products/ProductsDetail.aspx?detailid=844&DetailName=Specification&MenuID=46&LanID=8 |date=October 12, 2007}},retrieved on October 4, 2007</ref>
*Codenamed ''RX780'',<ref>{{Cite web |url=http://dailytech.com/Partners+Showcase+AMD+RD790+Motherboards/article7580.htm |title=DailyTech report |access-date=2007-06-07 |archive-url=https://web.archive.org/web/20070609171028/http://dailytech.com/Partners+Showcase+AMD+RD790+Motherboards/article7580.htm |archive-date=2007-06-09 |url-status=dead}}</ref> final product name revealed by [[Elitegroup Computer Systems|ECS]]<ref>[http://www.ecs.com.tw/ECSWebSite/Products/ProductsDetail.aspx?detailid=844&DetailName=Specification&MenuID=46&LanID=8 ECS products page] {{webarchive |url=https://web.archive.org/web/20071012015135/http://www.ecs.com.tw/ECSWebSite/Products/ProductsDetail.aspx?detailid=844&DetailName=Specification&MenuID=46&LanID=8 |date=October 12, 2007}}. Retrieved October 4, 2007.</ref>
*Single AMD processor configuration
*Single AMD processor configuration
*One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
**65 nm [[CMOS]] fabrication process manufactured by [[TSMC]]
**65 nm [[CMOS]] fabrication process manufactured by [[TSMC]]
*Mobile version (M770, codenamed ''RX781''), supports discrete graphics, and support for "add-on" graphics solution, via external [[PCI Express|PCI-E]] cabling<ref>[http://www.fudzilla.com/index.php?option=com_content&task=view&id=1781&Itemid=1 Fudzilla report]</ref>
*Mobile version (M770, codenamed ''RX781''), supports discrete graphics, and support for "add-on" graphics solution, via external [[PCI Express|PCI-E]] cabling<ref>[http://www.fudzilla.com/index.php?option=com_content&task=view&id=1781&Itemid=1 Fudzilla report]</ref>
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*Single AMD processor configuration
*Single AMD processor configuration
*One physical PCIe 2.0 x16 slot and one PCIe 2.0 x4 slot, the chipset provides a total of 20 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 2.0 x16 slot and one PCIe 2.0 x4 slot, the chipset provides a total of 20 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*[[AMD 700 chipset series#Integrated graphics|Integrated graphics]]: Radeon HD 3000
*55 nm [[CMOS]] fabrication process manufactured by [[TSMC]]
*55 nm [[CMOS]] fabrication process manufactured by [[TSMC]]
*HyperTransport 3.0 and PCI Express 2.0
*HyperTransport 3.0 and PCI Express 2.0
*Value DirectX 10.0 IGP segment
*Value DirectX 10.0 IGP segment
*Public documentation is not available yet
*Public documentation is not available yet
=
===740===
===740===
*Codenamed ''RX740''<ref>[http://www.dailytech.com/more+details+on+amd+stars+chipsets/article7147.htm DailyTech report] {{Webarchive|url=https://web.archive.org/web/20071009040625/http://www.dailytech.com/more+details+on+amd+stars+chipsets/article7147.htm |date=2007-10-09}}, retrievedon October 8, 2007</ref>
*Codenamed ''RX740''<ref>[http://www.dailytech.com/more+details+on+amd+stars+chipsets/article7147.htm DailyTech report] {{Webarchive|url=https://web.archive.org/web/20071009040625/http://www.dailytech.com/more+details+on+amd+stars+chipsets/article7147.htm |date=2007-10-09}}. Retrieved October 8, 2007.</ref>
*Single AMD processor configuration
*Single AMD processor configuration
*One physical PCIe 1.1 x16 slot and one PCIe 1.1 x4 slot, the chipset provides a total of 20 PCIe 1.1 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*One physical PCIe 1.1 x16 slot and one PCIe 1.1 x4 slot, the chipset provides a total of 20 PCIe 1.1 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
*Consumer [[Infrared communication|Infrared]] receiver/transmitter port compatible with [[Infrared Data Association|IrDA]] standards<ref>[<!--http://www.xbitlabs.com/news/chipsets/display/20071025140102.html-->http://www.xbitlabs.com/news/mainboards/display/20071025140102.html X-bitlabsreport]. Retrieved October 26, 2007.</ref>
*Consumer [[Infrared communication|Infrared]] receiver/transmitter port compatible with [[Infrared Data Association|IrDA]] standards<ref>{{cite web |url=http://www.xbitlabs.com/news/mainboards/display/20071025140102.html |title=AMD's New I/O Controller to Aim Consumers, Enterprises |work=BIOSTAR USA |archive-url=https://web.archive.org/web/20140222060857/http://www.xbitlabs.com/news/mainboards/display/20071025140102.html |archive-date=2014-02-22 |url-status=dead |access-date=2021-07-09}}</ref>
*[[Desktop and mobile Architecture for System Hardware|DASH]] 1.0 support
*[[Desktop and mobile Architecture for System Hardware|DASH]] 1.0 support
====SB710====
====SB710====
*All features from SB700
*[[File:MSI 760GM-E51 (FX) - AMD Southbride 218-0660017-9671.jpg|thumb|AMD Southbridge SB710]]All features from SB700
*[[Super I/O]]
*[[Super I/O]]
*[[AMD OverDrive|Advanced Clock Calibration]] for enhanced CPU overclocking
*[[AMD OverDrive|Advanced Clock Calibration]] for enhanced CPU overclocking
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*[[RAID 5]] support
*[[RAID 5]] support
*[[Super I/O]]
*[[Super I/O]]
*Enhanced CPU overclocking for [[AMD K10|K10]]-based processors only, originally named "OverDrive 3.0"<ref name="Fudzilla_Overdrive_30">[http://www.fudzilla.com/index.php?option=com_content&task=view&id=6956&Itemid=37 Fudzilla report], retrieved May 2, 2008 {{webarchive |url=https://web.archive.org/web/20080424230045/http://www.fudzilla.com/index.php?option=com_content&task=view&id=6956&Itemid=37 |date=April 24, 2008}}</ref>
*Enhanced CPU overclocking for [[AMD K10|K10]]-based processors only, originally named "OverDrive 3.0"<ref name="Fudzilla_Overdrive_30">[http://www.fudzilla.com/index.php?option=com_content&task=view&id=6956&Itemid=37 Fudzilla report], retrieved May 2, 2008 {{webarchive |url=https://web.archive.org/web/20080424230045/http://www.fudzilla.com/index.php?option=com_content&task=view&id=6956&Itemid=37 |date=April 24, 2008}}</ref>
**Direct communication channel composed of six data pins which were previously reserved between the CPU and the southbridge
**Direct communication channel composed of six data pins which were previously reserved between the CPU and the southbridge
**[[AMD OverDrive|Advanced Clock Calibration]] (Option available with AMD OverDrive software 2.1.1 and later)
**[[AMD OverDrive|Advanced Clock Calibration]] (Option available with AMD OverDrive software 2.1.1 and later)
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*[[Super I/O]]
*[[Super I/O]]
*Target for future [[AMD 800 chipset series|server chipsets]]<ref name="HKEPC780G" />
*Target for future [[AMD 800 chipset series|server chipsets]]<ref name="HKEPC780G" />
*Originally named SB700S,<ref>{{jaicon}} [http://pc.watch.impress.co.jp/docs/2008/0520/kaigai440.htm PC Watch report]. Retrieved August 20, 2008.</ref> later renamed as SP5100.<ref>{{jaicon}} [http://www.4gamer.net/games/039/G003983/20080819040/ 4gamer.net coverage]. Retrieved August 20, 2008.</ref>
*Originally named SB700S,<ref>{{in lang|ja}} [http://pc.watch.impress.co.jp/docs/2008/0520/kaigai440.htm PC Watch report]. Retrieved August 20, 2008.</ref> later renamed as SP5100.<ref>{{in lang|ja}} [http://www.4gamer.net/games/039/G003983/20080819040/ 4gamer.net coverage]. Retrieved August 20, 2008.</ref>
====SB750S====
====SB750S====
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For the performance segment, CrossFire on the AMD 790X chipset has two physical [[PCI-E]] x16 slots<ref name="Chile2"/> with one operating at x8 bandwidth (dual-card 8x-8x CrossFire), supporting up to four [[Computer display|display monitors]].
For the performance segment, CrossFire on the AMD 790X chipset has two physical [[PCI-E]] x16 slots<ref name="Chile2"/> with one operating at x8 bandwidth (dual-card 8x-8x CrossFire), supporting up to four [[Computer display|display monitors]].
Multi-graphics is also supported for the 790GX IGP chipset, named as [[AMD 700 chipsetseries#Hybrid CrossFire/Hybrid CrossFireX|Hybrid CrossFire X]].
Multi-graphics is also supported for the 790GX IGP chipset, named as [[AMD Hybrid Graphics#Hybrid CrossFire / Hybrid CrossFireX / Dual Graphics|Hybrid CrossFire X]].
===AMD OverDrive===
===AMD OverDrive===
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===AutoXpress===
===AutoXpress===
The AutoXpress technology is a set of automatic system tuning features to enhance system performance, which were revealed by members of ChileHardware when investigating the [[Basic Input/Output System|BIOS]] for AMD 790FX, 790X and 770 chipsets.<ref>[http://www.chilehardware.com/foro/novedades-chipsets-amd-t115496.html?p=1380609#post1380609 ChileHardware discussion thread] {{webarchive|url=https://web.archive.org/web/20071015102647/http://chilehardware.com/foro/novedades-chipsets-amd-t115496.html?p=1380609 |date=2007-10-15}}. Retrieved October 4, 2007.</ref> AutoXpress will be available on AMD 790FX (codenamed ''RD790'') chipset, with AMD 790X (codenamed ''RD780'') and AMD 770 (codenamed ''RX780'') chipsets implementing a subset of all the features. The AutoXpress technology is similar to the ''LinkBoost'' capability presented on [[NVIDIA]] [[nForce 500]]/[[nForce 600|600]] chipsets.
The AutoXpress technology is a set of automatic system tuning features to enhance system performance, which were revealed by members of ChileHardware when investigating the [[Basic Input/Output System|BIOS]] for AMD 790FX, 790X and 770 chipsets.<ref>[http://www.chilehardware.com/foro/novedades-chipsets-amd-t115496.html?p=1380609#post1380609 ChileHardware discussion thread] {{webarchive|url=https://web.archive.org/web/20071015102647/http://chilehardware.com/foro/novedades-chipsets-amd-t115496.html?p=1380609 |date=2007-10-15}}. Retrieved October 4, 2007.</ref> AutoXpress will be available on AMD 790FX (codenamed ''RD790'') chipset, with AMD 790X (codenamed ''RD780'') and AMD 770 (codenamed ''RX780'') chipsets implementing a subset of all the features. The AutoXpress technology is similar to the ''LinkBoost'' capability presented on [[NVIDIA]] [[nForce 500]]/[[nForce 600|600]] chipsets.
The feature must be enabled via BIOS, options appeared in the BIOS includes ON/OFF/Custom, which choosing the "Custom" option will open up three further options, namely "CPU", "XpressRoute" and "MemBoost" with ON/OFF options, and ON as default. Details about the AutoXpress features are listed as follows:
The feature must be enabled via BIOS, options appeared in the BIOS includes ON/OFF/Custom, which choosing the "Custom" option will open up three further options, namely "CPU", "XpressRoute" and "MemBoost" with ON/OFF options, and ON as default. Details about the AutoXpress features are listed as follows:
| 790FX || colspan="4"|Read performance SPD settings of high-end modules and<br />set as default, giving maximum performance
| 790FX || colspan="4"|Read performance SPD settings of high-end modules and<br />set as default, giving maximum performance
|}
|}
</center>
===Advanced Clock Calibration===
===Advanced Clock Calibration===
Advanced clock calibration (ACC) is a feature originally available for Phenom families of processors, particularly for Black Edition ones, to increase the overclocking potential of the CPU. ACC is supported by the SB710 and the SB750 southbridges, and available through BIOS settings on some motherboards and AMD OverDrive utility.<ref>{{cite web|url=http://www.anandtech.com/show/2573/2 |title=AMD's SB750: Enabling Higher Phenom Overclocks? |publisher=AnandTech |date= |accessdate=2013-02-10}}</ref>
Advanced clock calibration (ACC) is a feature originally available for Phenom families of processors, particularly for Black Edition ones, to increase the overclocking potential of the CPU. ACC is supported by the SB710 and the SB750 southbridges, and available through BIOS settings on some motherboards and AMD OverDrive utility.<ref>{{cite web|url=http://www.anandtech.com/show/2573/2 |title=AMD's SB750: Enabling Higher Phenom Overclocks? |publisher=AnandTech |access-date=2013-02-10}}</ref>
It was later discovered that this functionality has the possibility of unlocking the supposedly disabled cores of some Phenom II X2/X3 processors. In normal cases, it is not possible to use or unlock any of those hidden cores because originally those cores were disabled: a technique called "chip harvesting" or "feature binning" used by AMD to sell parts with one or two defective cores which will cause system instability if not disabled.
It was later discovered that this functionality has the possibility of unlocking the supposedly disabled cores of some Phenom II X2/X3 processors. In normal cases, it is not possible to use or unlock any of those hidden cores because originally those cores were disabled: a technique called "chip harvesting" or "feature binning" used by AMD to sell parts with one or two defective cores which will cause system instability if not disabled.
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# Possibility of unlocking AMD Phenom II X2/X3, AMD Athlon II X2/X3 and AMD Sempron locked cores / cache. (with BIOS support)
# Possibility of unlocking AMD Phenom II X2/X3, AMD Athlon II X2/X3 and AMD Sempron locked cores / cache. (with BIOS support)
The principle of ACC is not publicly discussed by AMD but some third-party vendors, including ASUS (Core Unlocker)<ref>{{cite web|url=http://usa.asus.com/FeatureList.aspx?PG_ID=mKyCKlQ4oSEtSu5m&F_ID=7131 |title=ASUS |publisher=Usa.asus.com |date= |accessdate=2013-02-10}}</ref> and Biostar (BIO-unlocKING)<ref>[http://www.biostar-usa.com/app/en%2Dus/event/biounlocking/model.htm ]{{webarchive|url=https://web.archive.org/web/20100420131546/http://www.biostar-usa.com/app/en-us/event/biounlocking/model.htm |date=April 20,2010 }}</ref> have had it for some time. Gigabyte has added this feature, called CPU Core Control, to many NB785/SB710 boards via BIOS update,<ref>{{cite web|url=http://www.giga-byte.com/Support/Motherboard/BIOS_List.aspx?CPUType=Socket+AM3 |title=Motherboard, Graphics Card, Notebook, Slate, Server, PC Peripherals and more |publisher=Gigabyte |date= |accessdate=2013-02-10}}{{dead link|date=December 2016 |bot=InternetArchiveBot |fix-attempted=yes}}</ref> and will be including this feature (now called Auto Unlock) in all of their 800 Series boards with the SB850 chip.<ref>{{cite web|url=http://www.giga-byte.com/FileList/WebPage/mb_amd800/images/amd800-models.htm |title=GIGABYTE 4-Way CrossFireX Motherboards|accessdate=February 19, 2016 |deadurl=yes |archiveurl=https://web.archive.org/web/20100509054247/http://www.giga-byte.com/FileList/WebPage/mb_amd800/images/amd800-models.htm |archivedate=May 9, 2010}}</ref> On many of the boards, the feature is dependent on BIOS version. While NVIDIA also has a similar technology for its [[nForce 700#nForce 780a|nForce 780a]] motherboards, called NVCC (NVIDIA Clock Calibration) with very similar functionality.
The principle of ACC is not publicly discussed by AMD but some third-party vendors, including ASUS (Core Unlocker)<ref>{{cite web|url=http://usa.asus.com/FeatureList.aspx?PG_ID=mKyCKlQ4oSEtSu5m&F_ID=7131 |title=ASUS |publisher=Usa.asus.com |access-date=2013-02-10}}</ref> and Biostar (BIO-unlocKING)<ref>{{cite web |url=http://www.biostar-usa.com/app/en%2Dus/event/biounlocking/model.htm |title=BIO-unlocKING |work=BIOSTAR USA |archive-url=https://web.archive.org/web/20100420131546/http://www.biostar-usa.com/app/en-us/event/biounlocking/model.htm |archive-date=2010-04-20 |url-status=dead |access-date=2021-07-09}}</ref> have had it for some time. Gigabyte has added this feature, called CPU Core Control, to many NB785/SB710 boards via BIOS update,<ref>{{cite web|url=http://www.giga-byte.com/Support/Motherboard/BIOS_List.aspx?CPUType=Socket+AM3 |title=Motherboard, Graphics Card, Notebook, Slate, Server, PC Peripherals and more |publisher=Gigabyte |access-date=2013-02-10}} {{dead link|date=December 2016 |bot=InternetArchiveBot |fix-attempted=yes}}</ref> and will be including this feature (now called Auto Unlock) in all of their 800 Series boards with the SB850 chip.<ref>{{cite web|url=http://www.giga-byte.com/FileList/WebPage/mb_amd800/images/amd800-models.htm |title=GIGABYTE 4-Way CrossFireX Motherboards|access-date=February 19, 2016 |url-status=dead |archive-url=https://web.archive.org/web/20100509054247/http://www.giga-byte.com/FileList/WebPage/mb_amd800/images/amd800-models.htm |archive-date=May 9, 2010}}</ref> On many of the boards, the feature is dependent on BIOS version. While NVIDIA also has a similar technology for its [[nForce 700#nForce 780a|nForce 780a]] motherboards, called NVCC (NVIDIA Clock Calibration) with very similar functionality.
===Energy efficiency===
===Energy efficiency===
One of the major focus of the chipset series is the energy efficiency of the chipsets. The need for energy-efficient chipsets have risen since chipsets starts including more features and more [[PCI Express]] lanes, to provide better system scalability by using PCI-E add-on cards.
One of the major focus of the chipset series is the energy efficiency of the chipsets. The need for energy-efficient chipsets have risen since chipsets starts including more features and more [[PCI Express]] lanes, to provide better system scalability by using PCI-E add-on cards.
But one issue is that chipset circuitries were usually made on a larger fabrication process nodes compared with the latest CPU process node, making recent chipsets consume more and more power than their predecessors. Recent examples including the [[Intel G33|Intel X38 chipset]] Northbridge (MCH), labelling 26.5 [[Watt|W]] [[Thermal Design Power|TDP]] with a maximum idle power of 12.3 W,<ref>{{cite web|url= http://download.intel.com/design/chipsets/designex/31761201.pdf |title=Intel Thermal and Mechanical Design Guidelines – For the Intel 82X38 Memory Controller Hub (MCH). September 2007, Revision -001}}, page 14 {{small|(2.38 MB)}}. Retrieved November 23, 2007.</ref> which results in the world'sfirst [[heat spreader|integrated heat spreader]] (IHS) design over the chip to help heat spread evenly, with [[ASUS]] even adding water cooling block directly on top of the heatsink of the X38 Northbridge as a part of the motherboard heatpipe system. Although the aforementioned figures may be small compared to the TDP figures of a performance CPU, there is a growing demand for computer systems with higher performance and lower power consumption. While Intel focuses only on the energy efficiency of its processors, NVIDIA's [[nForce 700#nForce 780i/790i|nForce 780i]] chipset requires an overall power consumption of 48 W with the northbridge, southbridge and the nForce 200 PCI-E bridge.<ref name="AMD790FX_NV780i_TDP" />
But one issue is that chipset circuitries were usually made on a larger fabrication process nodes compared with the latest CPU process node, making recent chipsets consume more and more power than their predecessors. Recent examples including the [[Intel G33|Intel X38 chipset]] Northbridge (MCH), labelling 26.5 [[Watt|W]] [[Thermal Design Power|TDP]] with a maximum idle power of 12.3 W,<ref>{{cite web|url= http://download.intel.com/design/chipsets/designex/31761201.pdf |title=Intel Thermal and Mechanical Design Guidelines – For the Intel 82X38 Memory Controller Hub (MCH). September 2007, Revision -001}}, page 14 {{small|(2.38 MB)}}. Retrieved November 23, 2007.</ref> which results in the usage of [[heat spreader|integrated heat spreader]] (IHS) design over the chip to help heat spread evenly, with [[ASUS]] even adding water cooling block directly on top of the heatsink of the X38 Northbridge as a part of the motherboard heatpipe system. Although the aforementioned figures may be small compared to the TDP figures of a performance CPU, there is a growing demand for computer systems with higher performance and lower power consumption. While Intel focuses only on the energy efficiency of its processors, NVIDIA's [[nForce 700#nForce 7xx|nForce 780i]] chipset requires an overall power consumption of 48 W with the northbridge, southbridge and the nForce 200 PCI-E bridge.<ref name="AMD790FX_NV780i_TDP" />
In response to this, all discrete northbridges of the chipset series were designed on a [[65 nm]] [[CMOS]] process, manufactured by [[TSMC]], aimed at lowering power consumptions of chipsets. According to internal testing and various reports, the Northbridge of the AMD 790FX chipset (''RD790'') runs at 3 [[Watt|W]] when idle, and maximum 10 [[Watt|W]] under load,<ref name="fud1">[http://www.fudzilla.com/index.php?option=com_content&task=view&id=1837&Itemid=1 Fudzilla report]</ref> nominal 8 [[Watt|W]] power consumption, the northbridge was seen on reference design of the AMD 790FX chipset with single passive cooling heatsink instead of connecting to [[heat pipe]]s which are frequently used on current performance motherboard offers,<ref name="AMD790FX_NV780i_TDP">[http://www.theinquirer.net/gb/inquirer/news/2007/10/11/amd-790fx-eats-8w The Inquirer report] {{webarchive|url=https://web.archive.org/web/20071012054435/http://www.theinquirer.net/gb/inquirer/news/2007/10/11/amd-790fx-eats-8w |date=2007-10-12 }}. Retrieved October 12, 2007.</ref> the chipset on the whole (the combination of RD790 Northbridge and [[AMD 580 chipset series#SB600 (Southbridge)|SB600 Southbridge]]) consumes nominally less than 15 [[Watt|W]].<ref>[http://www.theinquirer.net/gb/inquirer/news/2007/10/17/gigabyte-debuts-socket-am2-amd The Inquirer report] {{webarchive |url=https://web.archive.org/web/20071019014113/http://www.theinquirer.net/gb/inquirer/news/2007/10/17/gigabyte-debuts-socket-am2-amd |date=October 19, 2007 }}. Retrieved October 17, 2007.</ref>
In response to this, all discrete northbridges of the chipset series were designed on a [[65 nm]] [[CMOS]] process, manufactured by [[TSMC]], aimed at lowering power consumptions of chipsets. According to internal testing and various reports, the Northbridge of the AMD 790FX chipset (''RD790'') runs at 3 [[Watt|W]] when idle, and maximum 10 [[Watt|W]] under load,<ref name="fud1">[http://www.fudzilla.com/index.php?option=com_content&task=view&id=1837&Itemid=1 Fudzilla report]</ref> nominal 8 [[Watt|W]] power consumption, the northbridge was seen on reference design of the AMD 790FX chipset with single passive cooling heatsink instead of connecting to [[heat pipe]]s which are frequently used on current performance motherboard offers,<ref name="AMD790FX_NV780i_TDP">{{cite web |url=http://www.theinquirer.net/gb/inquirer/news/2007/10/11/amd-790fx-eats-8w |title=AMD 790FX chipset consumes only 8W |work=[[The Inquirer]] |archive-url=https://web.archive.org/web/20071012054435/http://www.theinquirer.net/gb/inquirer/news/2007/10/11/amd-790fx-eats-8w |archive-date=2007-10-12 |url-status=dead |access-date=2021-07-09}}</ref> the chipset on the whole (the combination of RD790 Northbridge and [[AMD 580 chipset series#SB600 (Southbridge)|SB600 Southbridge]]) consumes nominally less than 15 [[Watt|W]].<ref>{{cite web |url=http://www.theinquirer.net/gb/inquirer/news/2007/10/17/gigabyte-debuts-socket-am2-amd |title=GigaByte debuts Socket AM2, AMD 790FX |work=[[The Inquirer]] |archive-url=https://web.archive.org/web/20071019014113/http://www.theinquirer.net/gb/inquirer/news/2007/10/17/gigabyte-debuts-socket-am2-amd |archive-date=October 19, 2007|url-status=dead |access-date=2021-07-09}}</ref>
The integrated graphics northbridges were also benefited, as most of the [[Integrated graphics|IGP]] northbridges were made on 55 nm process manufactured by TSMC with the inclusion of [[ATI PowerPlay|ATI PowerPlay technology]], allowing dynamically changing the core clock frequency to minimum 150 MHz.<ref name="PCW497" /> The 780G Northbridge, sporting [[DirectX 10]] support, consumes only 11.4 W on full load,<ref name="HKEPC780G" /> 0.94 watt when idle.<ref>{{zhicon}} [http://www.pczilla.net/upload/200803051054362350.jpg PCZilla report]{{dead link|date=October 2016 |bot=InternetArchiveBot |fix-attempted=yes}}. Test results according to AMD. Retrieved March 7, 2008.</ref> This is also smaller than the TDP figures of the Intel G35 chipset Northbridge at 28 W with the maximum idle power of 11 W.<ref>{{cite web|url= http://download.intel.com/design/chipsets/designex/31760901.pdf |title=Intel Thermal and Mechanical Design Guidelines – For the Intel 82G35 Graphics and Memory Controller Hub (GMCH). August 2007, Revision -001}}, page 14 {{small|(1.42 MB)}}. Retrieved November 23, 2007.</ref>
The integrated graphics northbridges were also benefited, as most of the [[Integrated graphics|IGP]] northbridges were made on 55 nm process manufactured by TSMC with the inclusion of [[ATI PowerPlay|ATI PowerPlay technology]], allowing dynamically changing the core clock frequency to minimum 150 MHz.<ref name="PCW497" /> The 780G Northbridge, sporting [[DirectX 10]] support, consumes only 11.4 W on full load,<ref name="HKEPC780G" /> 0.94 watt when idle.<ref>{{in lang|zh}} [http://www.pczilla.net/upload/200803051054362350.jpg PCZilla report] {{dead link|date=October 2016 |bot=InternetArchiveBot |fix-attempted=yes}}. Test results according to AMD. Retrieved March 7, 2008.</ref> This is also smaller than the TDP figures of the Intel G35 chipset Northbridge at 28 W with the maximum idle power of 11 W.<ref>{{cite web|url= http://download.intel.com/design/chipsets/designex/31760901.pdf |title=Intel Thermal and Mechanical Design Guidelines – For the Intel 82G35 Graphics and Memory Controller Hub (GMCH). August 2007, Revision -001}}, page 14 {{small|(1.42 MB)}}. Retrieved November 23, 2007.</ref>
===ATI Hybrid Graphics===
===ATI Hybrid Graphics===
{{Main|ATI Hybrid Graphics}}
{{Main|ATI Hybrid Graphics}}
The ATI Hybrid Graphics technology applies to all or some of the [[AMD 700 chipset series#Integrated graphics|integrated graphics chipsets]] of this chipset series, technologies including [[ATI Hybrid Graphics#Hybrid CrossFire/Hybrid CrossFireX|Hybrid CrossFire X]], [[ATI Hybrid Graphics#SurroundView|SurroundView]] and [[ATI Hybrid Graphics#PowerXpress|PowerXpress]]. Reports confirmed that the 790GX IGP (codenamed ''RS780D'') chipset will be able to handle dual video card and IGP as a CrossFire X setup.<ref name="HKEPC4">{{zhicon}} [http://hkepc.com/?id=484 HKEPC report]: AMD touts Hybrid Crossfire X technology, combining IGP and GPU, available in Q2 2008. Retrieved December 12, 2007.</ref> Hybrid Graphics are only available with 24xx, 34xx, & 42xx model ATI graphics cards.
The ATI Hybrid Graphics technology applies to all or some of the [[#Integrated graphics|integrated graphics chipsets]] of this chipset series, technologies including [[AMD Hybrid Graphics#Hybrid CrossFire / Hybrid CrossFireX / Dual Graphics|Hybrid CrossFire X]], [[AMD Hybrid Graphics#SurroundView|SurroundView]] and [[AMD Hybrid Graphics#PowerXpress|PowerXpress]]. Reports confirmed that the 790GX IGP (codenamed ''RS780D'') chipset will be able to handle dual video card and IGP as a CrossFire X setup.<ref name="HKEPC4">{{in lang|zh}} [http://hkepc.com/?id=484 HKEPC report]: AMD touts Hybrid Crossfire X technology, combining IGP and GPU, available in Q2 2008. Retrieved December 12, 2007.</ref> Hybrid Graphics are only available with 24xx, 34xx, & 42xx model ATI graphics cards.
===I/O acceleration technologies===
===I/O acceleration technologies===
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====HyperFlash====
====HyperFlash====
The '''HyperFlash''', basically a NAND flash module on a card, originally planned as a device connected to the supported [[Parallel ATA|IDE]]/[[Advanced Technology Attachment|ATA]] 66/100/133 channel, to speed up system performance<ref name="Daily3">{{Cite web |url=http://dailytech.com/AMD+Readies+Trevally+Mobile+Platform/article5989.htm |title=DailyTech report |access-date=2007-02-06 |archive-url=https://web.archive.org/web/20070208022851/http://www.dailytech.com/AMD%2BReadies%2BTrevally%2BMobile%2BPlatform/article5989.htm |archive-date=2007-02-08 |dead-url=yes |df= }}</ref> through the [[ReadyBoost|Windows ReadyBoost]] and [[ReadyDrive|Windows ReadyDrive]] functionality.
The '''HyperFlash''', basically a NAND flash module on a card, originally planned as a device connected to the supported [[Parallel ATA|IDE]]/[[Advanced Technology Attachment|ATA]] 66/100/133 channel, to speed up system performance<ref name="Daily3">{{cite web |url=http://dailytech.com/AMD+Readies+Trevally+Mobile+Platform/article5989.htm |title=DailyTech report |access-date=2007-02-06 |archive-url=https://web.archive.org/web/20070208022851/http://www.dailytech.com/AMD%2BReadies%2BTrevally%2BMobile%2BPlatform/article5989.htm |archive-date=2007-02-08 |url-status=dead}}</ref> through the [[ReadyBoost|Windows ReadyBoost]] and [[ReadyDrive|Windows ReadyDrive]] functionality.
A HyperFlash module consists of two parts, the first part is a HyperFlash memory card which are flash memory chips on a small PCB (dimensions similar to a [[Quarter (Canadian coin)|Canadian quarter]] 25¢, with diameter 23.88 mm, but rectangular in shape) with contacts similar to [[SO-DIMM]] modules. The other part is a [[flash controller]] on an [[AT Attachment|ATA]] connector, with similar [[latch (electronics)|latch]]es/socket ejectors as SO-DIMM sockets. The HyperFlash memory card is inserted into the flash controller and then directly plugged into the motherboard ATA connector. The memory chips used on the HyperFlash memory card will be [[Samsung]]'s [http://www.samsung.com/global/business/semiconductor/products/fusionmemory/Products_OneNAND.html OneNAND flash memory modules] with maximum four-die configuration (four-die in a single package), running at 83 [[MHz]] frequency,<ref>[http://www.samsung.com/global/business/semiconductor/products/fusionmemory/downloads/OneNAND.pdf Samsung OneNAND product identification guide]. Retrieved October 25, 2007.</ref> providing a bandwidth of 108MB/s on a 16-bit bus width. Since the flash controller is designed to be compatible with [[AT Attachment|ATA]] pin-out definitions (also to fit the ATA motherboard connector) and is designed by [[Molex]], this allows [[Original Equipment Manufacturer|OEM]]s to produce their own brands of HyperFlash modules while at the same time providing maximum compatibility between HyperFlash modules.
A HyperFlash module consists of two parts, the first part is a HyperFlash memory card which are flash memory chips on a small PCB (dimensions similar to a [[Quarter (Canadian coin)|Canadian quarter]] 25¢, with diameter 23.88 mm, but rectangular in shape) with contacts similar to [[SO-DIMM]] modules. The other part is a [[flash controller]] on an [[AT Attachment|ATA]] connector, with similar [[latch (electronics)|latch]]es/socket ejectors as SO-DIMM sockets. The HyperFlash memory card is inserted into the flash controller and then directly plugged into the motherboard ATA connector. The memory chips used on the HyperFlash memory card will be [[Samsung]]'s [http://www.samsung.com/global/business/semiconductor/products/fusionmemory/Products_OneNAND.html OneNAND flash memory modules] with maximum four-die configuration (four-die in a single package), running at 83 [[MHz]] frequency,<ref>[http://www.samsung.com/global/business/semiconductor/products/fusionmemory/downloads/OneNAND.pdf Samsung OneNAND product identification guide]. Retrieved October 25, 2007.</ref> providing a bandwidth of 108 MB/s on a 16-bit bus width. Since the flash controller is designed to be compatible with [[AT Attachment|ATA]] pin-out definitions (also to fit the ATA motherboard connector) and is designed by [[Molex]], this allows [[Original Equipment Manufacturer|OEM]]s to produce their own brands of HyperFlash modules while at the same time providing maximum compatibility between HyperFlash modules.
Three variants were reportedly be available for HyperFlash modules, with capacity of 512MiB, 1GiB and 2GiB respectively, with expected [[Engineering validation test#Design verification test|DVT]] samples in November 2007 and mass-production expected in December 2007 (supported by [[Betaware|Beta]] motherboard drivers) and official motherboard driver support planned in February 2008.<ref>{{zhicon}} [http://hkepc.com/?id=262 HKEPC report]. Retrieved October 25, 2007.</ref> However, it was reportedly cancelled.<ref>[http://www.tgdaily.com/content/view/37780/135/ TGDaily report] {{webarchive|url=https://web.archive.org/web/20080604185915/http://www.tgdaily.com/content/view/37780/135/ |date=2008-06-04}}. Retrieved June 4, 2008.</ref>
Three variants were reportedly available for HyperFlash modules, with capacity of 512 MiB, 1 GiB and 2 GiB respectively, with expected [[Engineering validation test#Design verification test|DVT]] samples in November 2007 and mass-production expected in December 2007 (supported by [[Betaware|Beta]] motherboard drivers) and official motherboard driver support planned in February 2008.<ref>{{in lang|zh}} [http://hkepc.com/?id=262 HKEPC report]. Retrieved October 25, 2007.</ref> However, it was reportedly cancelled.<ref>[http://www.tgdaily.com/content/view/37780/135/ TGDaily report] {{webarchive|url=https://web.archive.org/web/20080604185915/http://www.tgdaily.com/content/view/37780/135/ |date=2008-06-04}}. Retrieved June 4, 2008.</ref>
====RAIDXpert====
====RAIDXpert====
The RAIDXpert is a remote RAID configuration tool, for changing the RAID level of the RAID setup connected via SATA 3.0Gbit/s ports (connected to SB600, excluding extra SATA 3.0Gbit/s ports through additional SATA chip on some motherboard implementations), including RAID 0, RAID 1, and RAID 0+1.
The RAIDXpert is a remote RAID configuration tool, for changing the RAID level of the RAID setup connected via SATA 3.0 Gbit/s ports (connected to SB600, excluding extra SATA 3.0 Gbit/s ports through additional SATA chip on some motherboard implementations), including RAID 0, RAID 1, and RAID 0+1.
===Integrated graphics===
===Integrated graphics===
Some of the members of the AMD 700 chipset series, specifically the 780 and 740 family of chipsets and the 790GX chipset, have integrated graphics onboard ([[Integrated Graphics Processor|IGP]]), as well as supporting hardware video playback acceleration at different levels. All IGP northbridges are [[Pin-compatibility|pin-compatible]] to each other and even predecessors ([[AMD 690 chipset series|690 series]]), to lower the product cost for each PCB redesign due to pin incompatibility and maximize the product lineup. These IGP features are listed below:
Some of the members of the AMD 700 chipset series, specifically the 780 and 740 family of chipsets and the 790GX chipset, have integrated graphics onboard ([[Integrated Graphics Processor|IGP]]), as well as supporting hardware video playback acceleration at different levels. All IGP northbridges are [[Pin-compatibility|pin-compatible]] to each other and even predecessors ([[AMD 690 chipset series|690 series]]), to lower the product cost for each PCB redesign due to pin incompatibility and maximize the product lineup. These IGP features are listed below:
#Dual video stream may include the following at a maximum total bitrate of 40Mbit/s:
#Dual video stream may include the following at a maximum total bitrate of 40 Mbit/s:
#*2 [[High-definition video|HD]] video streams '''OR'''
#*2 [[High-definition video|HD]] video streams '''OR'''
#*1 HD video stream + 1 [[SD video]] stream + 1 HD audio stream
#*1 HD video stream + 1 [[SD video]] stream + 1 HD audio stream
#760G supports DisplayPort and HDMI signals as video output, but actual implementation will depend on different motherboard designs.<ref>[http://news.ati-forum.de/images/stories/Szymanski/News/2009/760G/760g%20-%20press%20background-7.jpg AMD 760G product slide]{{dead link|date=October 2016 |bot=InternetArchiveBot |fix-attempted=yes}}. Retrieved January 20, 2009.</ref>
#760G supports DisplayPort and HDMI signals as video output, but actual implementation will depend on different motherboard designs.<ref>[http://news.ati-forum.de/images/stories/Szymanski/News/2009/760G/760g%20-%20press%20background-7.jpg AMD 760G product slide] {{dead link|date=October 2016 |bot=InternetArchiveBot |fix-attempted=yes}}. Retrieved January 20, 2009.</ref>
|}
|}
</center>
==="Remote IT"===
==="Remote IT"===
For the enterprise platform, the "Remote IT" technology (temporary name) was reported to be released by the end of 2007 or early 2008. The platform composed of an AMD 780V chipset with an SB700 southbridge, and chips from Broadcom, Realtek and Marvell.<ref name="DigiTimes1">[http://www.digitimes.com/systems/a20070720PD210.html DigiTimes report]. Retrieved July 21, 2007.</ref> It was reported to have incorporated the Broadcom BCM5761 managed NIC controller with [[Intelligent Platform Management Interface]] (IPMI) 1.5 manageability standard,<ref>[http://www.dailytech.com/More+AMD+RS780+Details+Revealed/article8237.htm DailyTech report] {{Webarchive|url=https://web.archive.org/web/20070813041657/http://www.dailytech.com/More+AMD+RS780+Details+Revealed/article8237.htm |date=2007-08-13}}. Retrieved August 1, 2007.</ref> together with [[Desktop and mobile Architecture for System Hardware|DASH 1.0]] specification ([http://www.dmtf.org/standards/mgmt/dash/ DASH page on] [[Distributed Management Task Force|DMTF]]) support of the SB700 and SB750 southbridges, and reported support additional management and security technologies such as IDM ([[Intelligent Device Management]]) and TPM 1.2 ([[Trusted Platform Module]]).<ref name="DigiTimes1" />
For the enterprise platform, the "Remote IT" technology (temporary name) was reported to be released by the end of 2007 or early 2008. The platform composed of an AMD 780V chipset with an SB700 southbridge, and chips from Broadcom, Realtek and Marvell.<ref name="DigiTimes1">[http://www.digitimes.com/systems/a20070720PD210.html DigiTimes report]. Retrieved July 21, 2007.</ref> It was reported to have incorporated the Broadcom BCM5761 managed NIC controller with [[Intelligent Platform Management Interface]] (IPMI) 1.5 manageability standard,<ref>[http://www.dailytech.com/More+AMD+RS780+Details+Revealed/article8237.htm DailyTech report] {{Webarchive|url=https://web.archive.org/web/20070813041657/http://www.dailytech.com/More+AMD+RS780+Details+Revealed/article8237.htm |date=2007-08-13}}. Retrieved August 1, 2007.</ref> together with [[Desktop and mobile Architecture for System Hardware|DASH 1.0]] specification ([http://www.dmtf.org/standards/mgmt/dash/ DASH page on] [[Distributed Management Task Force|DMTF]]) support of the SB700 and SB750 southbridges, and reported support additional management and security technologies such as IDM ([[Intelligent Device Management]]) and TPM 1.2 ([[Trusted Platform Module]]).<ref name="DigiTimes1" />
==Reception==
==Reception==
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**Low speed instability with [[HyperTransport]] version 3 capable processors. HT3 speeds 1.2 GHz up to 1.6 GHz should not be used, only 1.8 up to 2.2 GHz speeds are safe to be used. HT3 processors operating at 1.6 GHz (Phenom X3 8250e, Phenom X4 9100e and Phenom X4 9150e) will suffer from high retry count on the HyperTransport link which may result in hangs on revision A12 northbridges.
**Low speed instability with [[HyperTransport]] version 3 capable processors. HT3 speeds 1.2 GHz up to 1.6 GHz should not be used, only 1.8 up to 2.2 GHz speeds are safe to be used. HT3 processors operating at 1.6 GHz (Phenom X3 8250e, Phenom X4 9100e and Phenom X4 9150e) will suffer from high retry count on the HyperTransport link which may result in hangs on revision A12 northbridges.
*Windows platform:
*Windows platform:
** Microsoft KB959345<ref>{{cite web|url=http://support.microsoft.com/kb/959345 |title=You cannot use the mouse or the keyboard to wake a Windows Vista-based or a Windows Server 2008-based computer that has an integrated graphics processor and a graphics card |publisher=Support.microsoft.com |date=2012-12-13 |accessdate=2013-02-10}}</ref>
** Microsoft KB959345<ref>{{cite web|url=http://support.microsoft.com/kb/959345 |title=You cannot use the mouse or the keyboard to wake a Windows Vista-based or a Windows Server 2008-based computer that has an integrated graphics processor and a graphics card |publisher=Support.microsoft.com |date=2012-12-13 |access-date=2013-02-10}}</ref>
==Southbridge issues (SB7x0)==
==Southbridge issues (SB7x0)==
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*Windows platform:
*Windows platform:
**Microsoft KB982091<ref>[http://support.microsoft.com/kb/982091 Microsoft Support KB 982091]: Stop error code 0x0000009F or Stop error code 0x000000FE on a Windows 7-based or Windows Vista-based computer that uses certain AMD USB EHCI host controllers</ref>
**Microsoft KB982091<ref>[http://support.microsoft.com/kb/982091 Microsoft Support KB 982091]: Stop error code 0x0000009F or Stop error code 0x000000FE on a Windows 7-based or Windows Vista-based computer that uses certain AMD USB EHCI host controllers</ref>
**Microsoft KB956871<ref>{{cite web|url=http://support.microsoft.com/kb/956871 |title=The system may crash when you put a Windows Vista-based computer or a Windows Server 2008-based computer into hibernation |publisher=Support.microsoft.com |date=2011-10-08 |accessdate=2013-02-10}}</ref>
**Microsoft KB956871<ref>{{cite web|url=http://support.microsoft.com/kb/956871 |title=The system may crash when you put a Windows Vista-based computer or a Windows Server 2008-based computer into hibernation |publisher=Support.microsoft.com |date=2011-10-08 |access-date=2013-02-10}}</ref>
**Microsoft KB953689<ref>{{cite web|url=http://support.microsoft.com/kb/953689 |title=A Windows Vista-based computer does not resume from hibernation (S4) or from standby (S3) if you run an application to set an RTC wake-up time |publisher=Support.microsoft.com |date=2008-06-17 |accessdate=2013-02-10}}</ref>
**Microsoft KB953689<ref>{{cite web|url=http://support.microsoft.com/kb/953689 |title=A Windows Vista-based computer does not resume from hibernation (S4) or from standby (S3) if you run an application to set an RTC wake-up time |publisher=Support.microsoft.com |date=2008-06-17 |access-date=2013-02-10}}</ref>
*Linux platform:
*Linux platform:
** [[High Precision Event Timer|HPET]] operation with [[Message Signaled Interrupts|MSI]] causes [[Low Pin Count|LPC]] [[Direct memory access|DMA]] corruption on devices using LPC DMA (floppy, parallel port, serial port in FIR mode) because MSI requests are misinterpreted as DMA cycles by the broken LPC controller<ref>[https://archive.is/20120713062250/http://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commit;h=73472a46b5b28116b145fb5fc05242c1aa8e1461 x86: Disable HPET MSI on ATI SB700/SB800]</ref>
** [[High Precision Event Timer|HPET]] operation with [[Message Signaled Interrupts|MSI]] causes [[Low Pin Count|LPC]] [[Direct memory access|DMA]] corruption on devices using LPC DMA (floppy, parallel port, serial port in FIR mode) because MSI requests are misinterpreted as DMA cycles by the broken LPC controller<ref>[https://archive.today/20120713062250/http://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commit;h=73472a46b5b28116b145fb5fc05242c1aa8e1461 x86: Disable HPET MSI on ATI SB700/SB800]</ref>
**[[Universal Serial Bus|USB]] freeze when multiple devices are connected through hub (related to AMD Product Advisory PA_SB700AK1)<ref>[https://archive.is/20120710175659/http://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commit;h=b09bc6cbae4dd3a2d35722668ef2c502a7b8b093 USB: fix SB700 usb subsystem hang bug]</ref>
**[[Universal Serial Bus|USB]] freeze when multiple devices are connected through hub (related to AMD Product Advisory PA_SB700AK1)<ref>[https://archive.today/20120710175659/http://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commit;h=b09bc6cbae4dd3a2d35722668ef2c502a7b8b093 USB: fix SB700 usb subsystem hang bug]</ref>
**Erratic behaviour of the [[High Precision Event Timer|HPET]] when Spread Spectrum is enabled (related to AMD Product Advisory PA_SB700AG2)<ref>[https://archive.is/20120709022347/http://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commit;h=a6825f1c1fa83b1e92b6715ee5771a4d6524d3b9 x86: hpet: workaround SB700 BIOS]</ref>
**Erratic behaviour of the [[High Precision Event Timer|HPET]] when Spread Spectrum is enabled (related to AMD Product Advisory PA_SB700AG2)<ref>[https://archive.today/20120709022347/http://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commit;h=a6825f1c1fa83b1e92b6715ee5771a4d6524d3b9 x86: hpet: workaround SB700 BIOS]</ref>
**Disabling legacy interrupts for [[Serial ATA|SATA]] disables MSI too<ref>{{cite web|url=https://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commitdiff;h=bc38b411fe696fad32b261f492cb4afbf1835256 |archive-url=https://archive.is/20120708105402/http://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commitdiff;h=bc38b411fe696fad32b261f492cb4afbf1835256 |dead-url=yes |archive-date=2012-07-08 |title=PCI: Add MSI INTX_DISABLE quirks for ATI SB700/800 SATA and IXP SB400 USB |date= |accessdate=2013-02-10}}</ref>
**Disabling legacy interrupts for [[Serial ATA|SATA]] disables MSI too<ref>{{cite web|url=https://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commitdiff;h=bc38b411fe696fad32b261f492cb4afbf1835256 |archive-url=https://archive.today/20120708105402/http://git.kernel.org/?p=linux/kernel/git/torvalds/linux-2.6.git;a=commitdiff;h=bc38b411fe696fad32b261f492cb4afbf1835256 |url-status=dead |archive-date=2012-07-08 |title=PCI: Add MSI INTX_DISABLE quirks for ATI SB700/800 SATA and IXP SB400 USB |access-date=2013-02-10}}</ref>
**SATA soft reset fails when [[Port multiplier|PMP]] is enabled and attached devices will not be detected
**SATA soft reset fails when [[Port multiplier|PMP]] is enabled and attached devices will not be detected
**SATA internal errors are ignored because the controller will set Serial ATA port Error when it should not
**SATA internal errors are ignored because the controller will set Serial ATA port Error when it should not
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*[[Advanced Micro Devices]]
*[[Advanced Micro Devices]]
*[[ATI Technologies]]
*[[ATI Technologies]]
*[[Comparison of AMD Chipsets]]
*[[List of AMD chipsets|Comparison of AMD chipsets]]
*[[Comparison of ATI graphics processing units]]
*[[List of AMD graphics processing units|Comparison of AMD graphics processing units]]
==References==
==References==
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{{DEFAULTSORT:Amd 700 Chipset Series}}
{{DEFAULTSORT:Amd 700 Chipset Series}}
[[Category:Advanced Micro Devices chipsets]]
[[Category:AMD chipsets]]
[[Category:ATI Technologies products]]
[[Category:ATI Technologies products]]
[[Category:Computer-related introductions in 2008]]
November 19, 2007 (790FX, 790X, 770) March 4, 2008 (780G, 740G) April 28, 2008 (780V)[1] June 4, 2008 (M780G) August 6, 2008 (790GX) October 26, 2008 (780E) April 26, 2010 (785E)
The AMD 700 chipset series (also called as AMD 7-Series Chipsets) is a set of chipsets designed by ATI for AMDPhenom processors to be sold under the AMD brand. Several members were launched in the end of 2007 and the first half of 2008, others launched throughout the rest of 2008.
The existence of the chipsets was proven in October 2006 through two hardware websites in Chile[2] and Spain[3] which posted the leaked slides of an ATI internal event, "ATI chipset update". In the slides, ATI has shown a series of RD700 series chipset logics codenamed RD790, RX790, RS780 and RS740 respectively. A SB700southbridge was also mentioned in the event. The 790X (codename RD780) chipset was spotted in Computex 2007, exhibited by ASUS. The RS780D was first reported by HKEPC[4] while the RX780H was first seen on ECS internal presentations.[5]
After the acquisition of ATI Technologies, AMD started to participate in the development of the chipset series. And as a result, the first performance and enthusiast segment chipsets products under the AMD brand, the 790FX, 790X and 770 chipsets were launched on November 19, 2007 as part of the Spider codenamed desktop performance platform. The 780 chipset series, first launched in China on January 23, 2008, and released worldwide on March 5, 2008 during CeBIT 2008,[6] mobile chipsets (M740G, M780G and M780T chipsets) were released on June 4, 2008 during Computex 2008 as part of the Puma mobile platform and the 790GX chipset was released on August 6, 2008, while some other members released at a later date in 2008. The 785G was announced on August 4, 2009.
Four physical PCIe 2.0 x16 slots @ x8 or two physical PCIe 2.0 x16 slots, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots,[9] the chipset provides a total of 38 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
Reference board codenamed "Wahoo"[10] for dual-processor system reference design board with three physical PCI-E x16 slots, and "HammerHead" for single-socket system reference design board with four physical PCI-E x16 slots, also notable was the reference boards includes two ATA ports and only four SATA 3.0 Gbit/s ports (as being paired with SB600 southbridge).
Will pair with SB750southbridge with support up to six SATA ports and enhanced Phenom processors overclocking via ACC functionality, and will later support Socket AM3 with DDR3 SDRAM support in the first quarter of 2009.
Codenamed RD780, final name revealed to be "AMD 790X chipset"[11]
Single AMD processor configuration
One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
Codenamed RS780D,[4] final name seen on internal AMD presentation[13]
Single AMD processor configuration
One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
Mobile version (M780G, codenamed RS780M/M780V, codenamed RS780MC) demonstrated in May 2007,[23] and will be available during second or third quarter (Q2-Q3) 2008,[24] with the implementation of PowerXpress technology, providing one PCI-E slot for AXIOM/MXM modules[25] and HyperFlash[26][27] support for the Puma platform
Mainstream hybrid graphics (DirectX 10 IGP) segment (780G), value and commercial DirectX 10 IGP segment (780V)
One physical PCIe 2.0 x16 slot or two physical PCIe 2.0 x16 slots @ x8, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
Codenamed RX780,[28] final product name revealed by ECS[29]
Single AMD processor configuration
One physical PCIe 2.0 x16 slot, one PCIe 2.0 x4 slot and two PCIe 2.0 x1 slots, the chipset provides a total of 22 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
One physical PCIe 2.0 x16 slot and one PCIe 2.0 x4 slot, the chipset provides a total of 20 PCIe 2.0 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
One physical PCIe 1.1 x16 slot and one PCIe 1.1 x4 slot, the chipset provides a total of 20 PCIe 1.1 lanes and 4 PCIe 1.1 for A-Link Express II solely in the Northbridge
Besides the use of SB600 southbridge for earlier releases of several members in late 2007, all of the above chipsets can also utilize newer southbridge designs, the SB700, SB710 and the SB750 southbridges. Future server chipsets will also utilize the server version (SB700S/SB750S) of the southbridges. Features provided by the southbridge are listed as follows:
This article needs to be updated. Please help update this section to reflect recent events or newly available information.(November 2010)
The ATI CrossFire X technology supports multiple video cards to be connected to enhance the visual display and 3D rendering capabilities of the system, using AFR mode and/or scissor mode. Alternatively, systems with multiple video card CrossFire X setup will support multiple display monitors up to eight.
For the AMD 790FX chipset, the CrossFire X technology allows up to 4 video cards to be connected, made possible as the chipset supports four physical PCI-E x16 slots.[9] The PCI-E lanes can be configured for 4 slots at x8 bandwidth or 2 slots at x16 bandwidth (16x-16x, 8x-8x-8x or 8x-8x-8x-8x CrossFire X setup). Reports indicate 2.6 times the performance with triple-card CrossFire than that of a single card,[36] and more than 3.3 times the performance increase for quad-card CrossFire. Gigabyte have revealed in a leaked product presentation that the four card CrossFire X setup does not require CrossFire connectors; the data will be exchanged among the PCI-E slots which is monitored and controlled by Catalyst drivers.
For the performance segment, CrossFire on the AMD 790X chipset has two physical PCI-E x16 slots[9] with one operating at x8 bandwidth (dual-card 8x-8x CrossFire), supporting up to four display monitors.
Multi-graphics is also supported for the 790GX IGP chipset, named as Hybrid CrossFire X.
Another feature is AMD OverDrive, an application designed to boost system performance through a list of items in real-time, without a system reboot, as listed below:
Real-time Overclocking:
Novice mode for users not familiar with system tuning, includes a slider of level 0 to 10 for easy system tuning
Advanced mode for more familiar enthusiasts to fine tune various system parameters including: Clock frequencies – independent clock frequencies for independent processor cores (Phenom processors only), PCI-E lanes, system bus frequency; Multipliers for each of the CPU cores and HyperTransport links (downward direction only except Black Edition processors); And voltages for CPU (VID and VDDC), CPU HyperTransport, DDR2 Memory (VDDQ and VTT), northbridge core (VCore) and Northbridge PCI-E. Overclocking also applies to the IGP and the side-port memory since the release of version 2.1.4.
"Auto Clock" for automatic fine-tuning and overclocking
Memory fine-tuning – DDR2 Memory parameters
System monitoring:
System information
Simple mode – Windows Task Manager like CPU cores usage histogram, with CPU core clock Frequencies, CPU Multipliers, CPU core voltages (VCore), CPU Temperature; GPU details including GPU core frequency, video memory frequency; and system parameters including system bus frequency, southbridge frequency, PCI-E lanes frequency and memory frequency
Detailed mode – include all system information items presented in the simple mode, with the addition of CPU caches, CPU voltages, memory details including memory frequencies and SPD settings, HyperTransport frequency and link width
System Monitor
(Optional) System benchmark, resulting a value to reflect relative system performance, tests include: integer computation, floating-point computation, memory speed, cache speed
(Optional) Processor stability test, normally runs for one hour, can also be run for a minimum of 1 minute or a maximum of seven days, to identify whether the system becomes unstable for use after fine-tuning under full-loading condition. Tests include: integer (integer units) calculations and stack operations test for each processor core, floating-point (128-bit FPU) calculations test for each processor core, calculation test (Phenom processors only), MCA registers checking test
Maintenance/User-friendly functionalities:
Profile(s) saving and loading capabilities
Log records output
The application will support all members of the AMD 700 chipset series, including the 740 series chipsets which are aimed at value markets, and AMD processors including Phenom and Athlon 64 family of processors, but due to architectural limitations, independent clock frequency settings for different processor cores (a feature implemented in the K10 microarchitecture) will not function on Athlon 64 family of processors (except for Athlon X2 7000 series which is based on K10).
The AutoXpress technology is a set of automatic system tuning features to enhance system performance, which were revealed by members of ChileHardware when investigating the BIOS for AMD 790FX, 790X and 770 chipsets.[37] AutoXpress will be available on AMD 790FX (codenamed RD790) chipset, with AMD 790X (codenamed RD780) and AMD 770 (codenamed RX780) chipsets implementing a subset of all the features. The AutoXpress technology is similar to the LinkBoost capability presented on NVIDIAnForce 500/600 chipsets.
The feature must be enabled via BIOS, options appeared in the BIOS includes ON/OFF/Custom, which choosing the "Custom" option will open up three further options, namely "CPU", "XpressRoute" and "MemBoost" with ON/OFF options, and ON as default. Details about the AutoXpress features are listed as follows:
Tweaking CAS latencies, as follows: tRC, tWR reduced by 2; tRRD, tWTR reduced by 1; tREF set to 7.8 μs from originally 3.9 μs; Enabling "Bank Swizzle Mode"; and Increase Bank Bypass Maximum to 7x
Advanced clock calibration (ACC) is a feature originally available for Phenom families of processors, particularly for Black Edition ones, to increase the overclocking potential of the CPU. ACC is supported by the SB710 and the SB750 southbridges, and available through BIOS settings on some motherboards and AMD OverDrive utility.[38]
It was later discovered that this functionality has the possibility of unlocking the supposedly disabled cores of some Phenom II X2/X3 processors. In normal cases, it is not possible to use or unlock any of those hidden cores because originally those cores were disabled: a technique called "chip harvesting" or "feature binning" used by AMD to sell parts with one or two defective cores which will cause system instability if not disabled.
The following are available through the Advanced Clock Calibration feature:
Auto or manual settings
Allow separate settings for each of the CPU cores
Allowed range: -12% to +12%
Possibility of unlocking AMD Phenom II X2/X3, AMD Athlon II X2/X3 and AMD Sempron locked cores / cache. (with BIOS support)
The principle of ACC is not publicly discussed by AMD but some third-party vendors, including ASUS (Core Unlocker)[39] and Biostar (BIO-unlocKING)[40] have had it for some time. Gigabyte has added this feature, called CPU Core Control, to many NB785/SB710 boards via BIOS update,[41] and will be including this feature (now called Auto Unlock) in all of their 800 Series boards with the SB850 chip.[42] On many of the boards, the feature is dependent on BIOS version. While NVIDIA also has a similar technology for its nForce 780a motherboards, called NVCC (NVIDIA Clock Calibration) with very similar functionality.
One of the major focus of the chipset series is the energy efficiency of the chipsets. The need for energy-efficient chipsets have risen since chipsets starts including more features and more PCI Express lanes, to provide better system scalability by using PCI-E add-on cards.
But one issue is that chipset circuitries were usually made on a larger fabrication process nodes compared with the latest CPU process node, making recent chipsets consume more and more power than their predecessors. Recent examples including the Intel X38 chipset Northbridge (MCH), labelling 26.5 WTDP with a maximum idle power of 12.3 W,[43] which results in the usage of integrated heat spreader (IHS) design over the chip to help heat spread evenly, with ASUS even adding water cooling block directly on top of the heatsink of the X38 Northbridge as a part of the motherboard heatpipe system. Although the aforementioned figures may be small compared to the TDP figures of a performance CPU, there is a growing demand for computer systems with higher performance and lower power consumption. While Intel focuses only on the energy efficiency of its processors, NVIDIA's nForce 780i chipset requires an overall power consumption of 48 W with the northbridge, southbridge and the nForce 200 PCI-E bridge.[44]
In response to this, all discrete northbridges of the chipset series were designed on a 65 nmCMOS process, manufactured by TSMC, aimed at lowering power consumptions of chipsets. According to internal testing and various reports, the Northbridge of the AMD 790FX chipset (RD790) runs at 3 W when idle, and maximum 10 W under load,[36] nominal 8 W power consumption, the northbridge was seen on reference design of the AMD 790FX chipset with single passive cooling heatsink instead of connecting to heat pipes which are frequently used on current performance motherboard offers,[44] the chipset on the whole (the combination of RD790 Northbridge and SB600 Southbridge) consumes nominally less than 15 W.[45]
The integrated graphics northbridges were also benefited, as most of the IGP northbridges were made on 55 nm process manufactured by TSMC with the inclusion of ATI PowerPlay technology, allowing dynamically changing the core clock frequency to minimum 150 MHz.[13] The 780G Northbridge, sporting DirectX 10 support, consumes only 11.4 W on full load,[19] 0.94 watt when idle.[46] This is also smaller than the TDP figures of the Intel G35 chipset Northbridge at 28 W with the maximum idle power of 11 W.[47]
The ATI Hybrid Graphics technology applies to all or some of the integrated graphics chipsets of this chipset series, technologies including Hybrid CrossFire X, SurroundView and PowerXpress. Reports confirmed that the 790GX IGP (codenamed RS780D) chipset will be able to handle dual video card and IGP as a CrossFire X setup.[4] Hybrid Graphics are only available with 24xx, 34xx, & 42xx model ATI graphics cards.
The southbridges also support hybrid drives via SATA or supported ATA ports, which is compliant with the requirements of the Windows ReadyDrive technology, which is basically a conventional hard drive with an embedded NAND flash module.
The HyperFlash, basically a NAND flash module on a card, originally planned as a device connected to the supported IDE/ATA 66/100/133 channel, to speed up system performance[48] through the Windows ReadyBoost and Windows ReadyDrive functionality.
A HyperFlash module consists of two parts, the first part is a HyperFlash memory card which are flash memory chips on a small PCB (dimensions similar to a Canadian quarter 25¢, with diameter 23.88 mm, but rectangular in shape) with contacts similar to SO-DIMM modules. The other part is a flash controller on an ATA connector, with similar latches/socket ejectors as SO-DIMM sockets. The HyperFlash memory card is inserted into the flash controller and then directly plugged into the motherboard ATA connector. The memory chips used on the HyperFlash memory card will be Samsung's OneNAND flash memory modules with maximum four-die configuration (four-die in a single package), running at 83 MHz frequency,[49] providing a bandwidth of 108 MB/s on a 16-bit bus width. Since the flash controller is designed to be compatible with ATA pin-out definitions (also to fit the ATA motherboard connector) and is designed by Molex, this allows OEMs to produce their own brands of HyperFlash modules while at the same time providing maximum compatibility between HyperFlash modules.
Three variants were reportedly available for HyperFlash modules, with capacity of 512 MiB, 1 GiB and 2 GiB respectively, with expected DVT samples in November 2007 and mass-production expected in December 2007 (supported by Beta motherboard drivers) and official motherboard driver support planned in February 2008.[50] However, it was reportedly cancelled.[51]
The RAIDXpert is a remote RAID configuration tool, for changing the RAID level of the RAID setup connected via SATA 3.0 Gbit/s ports (connected to SB600, excluding extra SATA 3.0 Gbit/s ports through additional SATA chip on some motherboard implementations), including RAID 0, RAID 1, and RAID 0+1.
Some of the members of the AMD 700 chipset series, specifically the 780 and 740 family of chipsets and the 790GX chipset, have integrated graphics onboard (IGP), as well as supporting hardware video playback acceleration at different levels. All IGP northbridges are pin-compatible to each other and even predecessors (690 series), to lower the product cost for each PCB redesign due to pin incompatibility and maximize the product lineup. These IGP features are listed below:
For the enterprise platform, the "Remote IT" technology (temporary name) was reported to be released by the end of 2007 or early 2008. The platform composed of an AMD 780V chipset with an SB700 southbridge, and chips from Broadcom, Realtek and Marvell.[53] It was reported to have incorporated the Broadcom BCM5761 managed NIC controller with Intelligent Platform Management Interface (IPMI) 1.5 manageability standard,[54] together with DASH 1.0 specification (DASH page onDMTF) support of the SB700 and SB750 southbridges, and reported support additional management and security technologies such as IDM (Intelligent Device Management) and TPM 1.2 (Trusted Platform Module).[53]
In a comparison against the GeForce 8200, Anandtech considered the 780G "a better balanced chipset offering improved casual gaming performance, equal video quality, similar power requirements, greater availability, and better pricing."[55] The 8200, however, was preferred as a single-purpose HTPC solution. Both chipsets were considered superior to Intel's G45/X4500HD, which was cited for a lack of driver quality and features, and a higher price.[55]
Low speed instability with HyperTransport version 3 capable processors. HT3 speeds 1.2 GHz up to 1.6 GHz should not be used, only 1.8 up to 2.2 GHz speeds are safe to be used. HT3 processors operating at 1.6 GHz (Phenom X3 8250e, Phenom X4 9100e and Phenom X4 9150e) will suffer from high retry count on the HyperTransport link which may result in hangs on revision A12 northbridges.
HPET operation with MSI causes LPCDMA corruption on devices using LPC DMA (floppy, parallel port, serial port in FIR mode) because MSI requests are misinterpreted as DMA cycles by the broken LPC controller[60]
USB freeze when multiple devices are connected through hub (related to AMD Product Advisory PA_SB700AK1)[61]
Erratic behaviour of the HPET when Spread Spectrum is enabled (related to AMD Product Advisory PA_SB700AG2)[62]
Disabling legacy interrupts for SATA disables MSI too[63]
SATA soft reset fails when PMP is enabled and attached devices will not be detected
SATA internal errors are ignored because the controller will set Serial ATA port Error when it should not
^Microsoft Support KB 982091: Stop error code 0x0000009F or Stop error code 0x000000FE on a Windows 7-based or Windows Vista-based computer that uses certain AMD USB EHCI host controllers
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