Micro Leadframe Package: Difference between revisions
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#REDIRECT [[Flat no-leads package]] |
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{{Unreferenced stub|auto=yes|date=December 2009}} |
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{{Mergeto|QFN|date=August 2009}} |
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[[Image:28 pin MLP integrated circuit.jpg|thumb|200px|right|MLP package 28-pin chip, upside down to show contacts]] |
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'''Micro Leadframe Package''' (MLP) is a family of [[integrated circuit]] [[QFN]] packages, used in [[Surface mount technology|surface mounted]] [[Electronics|electronic]] circuits designs. It is available in 3 versions which are MLPQ (Q stands for Quad), MLPM (M stands for Micro) and MLPD (D stands for Dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to [[Chip Scale Package]]s (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for [[Small-outline integrated circuit]] (SOIC) packages. |
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[[Category:Chip carriers]] |
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{{Electronics-stub}} |
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[[pt:Micro Leadframe Package]] |
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Latest revision as of 13:13, 3 August 2020
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