PIND: Difference between revisions
Appearance
Content deleted Content added
No edit summary |
Rescuing 2 sources and tagging 0 as dead.) #IABot (v2.0 |
||
(25 intermediate revisions by 17 users not shown) | |||
Line 1: | Line 1: | ||
⚫ | |||
{{Orphan|date=February 2009}} |
|||
⚫ | |||
According to method 2020.9 of [[MIL-STD-883]] and method 2052.5 of [[MIL-STD-750]], the purpose of a PIND test is to detect loose particles inside an electronics device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient [[mass]] that, upon impact within the cavity, excite the [[transducer]]. |
|||
[http://www.b-w-engineering.com] |
|||
[File:<blockquote> |
|||
Example.jpg |
|||
</blockquote>{| class="wikitable" |
|||
<ref>{{cite web|title=Test Method Standard Microelectronic Circuits MIL-STD-883J w/Change 5|url=http://www.dscc.dla.mil/downloads/milspec/docs/mil-std-883/std883.pdf|publisher=Department of Defense|accessdate=17 December 2015|archive-url=https://web.archive.org/web/20160304190531/http://www.dscc.dla.mil/downloads/milspec/docs/mil-std-883/std883.pdf|archive-date=4 March 2016|url-status=dead}}</ref> |
|||
|}]]]. |
|||
<ref>{{cite web|title=TEST METHOD STANDARD TEST METHODS FOR SEMICONDUCTOR DEVICES MIL-STD-750F|url=http://www.landandmaritime.dla.mil/Downloads/MilSpec/Docs/MIL-STD-750/std750part2.pdf|publisher=Department of Defense|access-date=2015-12-17|archive-url=https://web.archive.org/web/20151222165824/http://www.landandmaritime.dla.mil/Downloads/MilSpec/Docs/MIL-STD-750/std750part2.pdf|archive-date=2015-12-22|url-status=dead}}</ref> |
|||
==References== |
|||
{{DEFAULTSORT:Pind}} |
|||
{{Reflist}} |
|||
[[Category:Particle physics]] |
|||
[[Category:Articles lacking sources (Erik9bot)]] |
|||
[[Category:Nondestructive testing]] |
|||
{{ |
{{measurement-stub}} |
Latest revision as of 11:18, 28 April 2020
A PIND test is a Particle Impact Noise Detection test.
According to method 2020.9 of MIL-STD-883 and method 2052.5 of MIL-STD-750, the purpose of a PIND test is to detect loose particles inside an electronics device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass that, upon impact within the cavity, excite the transducer.
References
[edit]- ^ "Test Method Standard Microelectronic Circuits MIL-STD-883J w/Change 5" (PDF). Department of Defense. Archived from the original (PDF) on 4 March 2016. Retrieved 17 December 2015.
- ^ "TEST METHOD STANDARD TEST METHODS FOR SEMICONDUCTOR DEVICES MIL-STD-750F" (PDF). Department of Defense. Archived from the original (PDF) on 2015-12-22. Retrieved 2015-12-17.