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Revision as of 09:40, 10 September 2022
The accessibility of this article is in question. Relevant discussion may be found on the talk page. (June 2022) |
Mac transition to Apple silicon |
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Apple silicon is a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. It is the basis of most new Mac computers as well as iPhone, iPad, iPod Touch, Apple TV, and Apple Watch, and of products such as AirPods, HomePod and its successor HomePod Mini, and AirTag.
Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020.[1][2] The first Macs built with the Apple M1 processor were unveiled on November 10, 2020. In 2022, the newest Mac models have been built with Apple silicon; only older models of the Mac Mini and the Mac Pro still use Intel Core and Xeon processors respectively.[3][4]
Apple outsources the chips' manufacture but fully controls their integration with the company's hardware and software. Johny Srouji is in charge of Apple's silicon design.[5]
A series
Evolution of Apple "A" series | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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The Apple "A" series is a family of SoCs used in the iPhone, certain iPad models (iPads Pro and Air models released since 2021 use the M1 SoC), and the Apple TV. "A" series chips were also used in the discontinued iPod Touch line and the original HomePod. They integrate one or more ARM-based processing cores (CPU), a graphics processing unit (GPU), cache memory and other electronics necessary to provide mobile computing functions within a single physical package.[6]
Apple A4
The Apple A4 is a PoP SoC manufactured by Samsung, the first SoC Apple designed in-house.[7] It combines an ARM Cortex-A8 CPU – also used in Samsung's S5PC110A01 SoC[8][9] – and a PowerVR SGX 535 graphics processor (GPU),[10][11][12] all built on Samsung's 45-nanometer silicon chip fabrication process.[13][14] The design emphasizes power efficiency.[15] The A4 commercially debuted in 2010, in Apple's iPad tablet,[10] and was later used in the iPhone 4 smartphone,[16] the fourth-generation iPod Touch, and the 2nd-generation Apple TV.[17]
The Cortex-A8 core used in the A4, dubbed "Hummingbird", is thought to use performance improvements developed by Samsung in collaboration with chip designer Intrinsity, which was subsequently acquired by Apple[18][19] It can run at far higher clock rates than other Cortex-A8 designs yet remains fully compatible with the design provided by ARM.[20] The A4 runs at different speeds in different products: 1 GHz in the first iPads,[21] 800 MHz in the iPhone 4 and fourth-generation iPod Touch, and an undisclosed speed in the 2nd-generation Apple TV.
The A4's SGX535 GPU could theoretically push 35 million polygons per second and 500 million pixels per second, although real-world performance may be considerably less.[22] Other performance improvements include additional L2 cache.
The A4 processor package does not contain RAM, but supports PoP installation. The 1st-generation iPad, fourth-generation iPod Touch,[23] and the 2nd-generation Apple TV[24] have an A4 mounted with two low-power 128 MB DDR SDRAM chips (totaling 256 MB), while the iPhone 4 has two 256 MB packages for a total of 512 MB.[25][26][27] The RAM is connected to the processor using ARM's 64-bit-wide AMBA 3 AXI bus. To give the iPad high graphics bandwidth, the width of the RAM data bus is double that used in previous ARM11- and ARM9-based Apple devices.[28]
Apple A5
The Apple A5 is an SoC manufactured by Samsung[29] that replaced the A4. The chip commercially debuted with the release of Apple's iPad 2 tablet in March 2011,[30] followed by its release in the iPhone 4S smartphone later that year. Compared to the A4, the A5 CPU "can do twice the work" and the GPU has "up to nine times the graphics performance",[31] according to Apple.
The A5 contains a dual-core ARM Cortex-A9 CPU[32] with ARM's advanced SIMD extension, marketed as NEON, and a dual core PowerVR SGX543MP2 GPU. This GPU can push between 70 and 80 million polygons/second and has a pixel fill rate of 2 billion pixels/second. The iPad 2's technical specifications page says the A5 is clocked at 1 GHz,[33] though it can adjust its frequency to save battery life.[32][34] The clock speed of the unit used in the iPhone 4S is 800 MHz. Like the A4, the A5 process size is 45 nm.[35]
An updated 32 nm version of the A5 processor was used in the 3rd-generation Apple TV, the fifth-generation iPod Touch, the iPad Mini, and the new version of iPad 2 (version iPad2,4).[36] The chip in the Apple TV has one core locked.[37][38] Markings on the square package indicate that it is named APL2498, and in software, the chip is called S5L8942. The 32 nm variant of the A5 provides around 15% better battery life during web browsing, 30% better when playing 3D games and about 20% better battery life during video playback.[39]
In March 2013, Apple released an updated version of the 3rd-generation Apple TV (Rev A, model A1469) containing a smaller, single-core version of the A5 processor. Unlike the other A5 variants, this version of the A5 is not a PoP, having no stacked RAM. The chip is very small, just 6.1×6.2 mm, but as the decrease in size is not due to a decrease in feature size (it is still on a 32 nm fabrication process), this indicates that this A5 revision is of a new design.[40] Markings tell that it is named APL7498, and in software, the chip is called S5L8947.[41][42]
Apple A5X
The Apple A5X is an SoC announced on March 7, 2012, at the launch of the third-generation iPad. It is a high-performance variant of the Apple A5; Apple claims it has twice the graphics performance of the A5.[43] It was superseded in the fourth-generation iPad by the Apple A6X processor.
The A5X has a quad-core graphics unit (PowerVR SGX543MP4) instead of the previous dual-core as well as a quad-channel memory controller that provides a memory bandwidth of 12.8 GB/s, roughly three times more than in the A5. The added graphics cores and extra memory channels add up to a very large die size of 165 mm²,[44] for example twice the size of Nvidia Tegra 3.[45] This is mainly due to the large PowerVR SGX543MP4 GPU. The clock frequency of the dual ARM Cortex-A9 cores have been shown to operate at the same 1 GHz frequency as in A5.[46] The RAM in A5X is separate from the main CPU package.[47]
Apple A6
The Apple A6 is a PoP SoC introduced on September 12, 2012, at the launch of the iPhone 5, then a year later was inherited by its minor successor the iPhone 5C. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A5.[48] It is 22% smaller and draws less power than the 45 nm A5.[49]
The A6 is said to use a 1.3 GHz[50] custom[51] Apple-designed ARMv7 based dual-core CPU, called Swift,[52] rather than a licensed CPU from ARM like in previous designs, and an integrated 266 MHz triple-core PowerVR SGX 543MP3[53] graphics processing unit (GPU). The Swift core in the A6 uses a new tweaked instruction set, ARMv7s, featuring some elements of the ARM Cortex-A15 such as support for the Advanced SIMD v2, and VFPv4.[51] The A6 is manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.[54]
Apple A6X
Apple A6X is an SoC introduced at the launch of the fourth-generation iPad on October 23, 2012. It is a high-performance variant of the Apple A6. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, the Apple A5X.[55]
Like the A6, this SoC continues to use the dual-core Swift CPU, but it has a new quad core GPU, quad channel memory and slightly higher 1.4 GHz CPU clock rate.[56] It uses an integrated quad-core PowerVR SGX 554MP4 graphics processing unit (GPU) running at 300 MHz and a quad-channel memory subsystem.[56][57] Compared to the A6 the A6X is 30% larger, but it continues to be manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.[57]
Apple A7
The Apple A7 is a 64-bit PoP SoC whose first appearance was in the iPhone 5S, which was introduced on September 10, 2013. The chip would also be used in the iPad Air, iPad Mini 2 and iPad Mini 3. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A6.[58] The Apple A7 chip is the first 64-bit chip to be used in a smartphone and later a tablet computer.[59]
The A7 features an Apple-designed 1.3[60]–1.4[61] GHz 64-bit[62] ARMv8-A[63][64] dual-core CPU,[60] called Cyclone,[63] and an integrated PowerVR G6430 GPU in a four cluster configuration.[65] The ARMv8-A architecture doubles the number of registers of the A7 compared to the A6.[66] It now has 31 general-purpose registers that are each 64-bits wide and 32 floating-point/NEON registers that are each 128-bits wide.[62] The A7 is manufactured by Samsung on a high-κ metal gate (HKMG) 28 nm process[67] and the chip includes over 1 billion transistors on a die 102 mm2 in size.[60]
Apple A8
The Apple A8 is a 64-bit PoP SoC manufactured by TSMC. Its first appearance was in the iPhone 6 and iPhone 6 Plus, which were introduced on September 9, 2014.[68] A year later it would drive the iPad Mini 4. Apple states that it has 25% more CPU performance and 50% more graphics performance while drawing only 50% of the power compared to its predecessor, the Apple A7.[69] On February 9, 2018, Apple released the HomePod, which is powered by an Apple A8 with 1 GB of RAM.[70]
The A8 features an Apple-designed 1.4[71] GHz 64-bit[72] ARMv8-A[72] dual-core CPU, and an integrated custom PowerVR GX6450 GPU in a four cluster configuration.[71] The GPU features custom shader cores and compiler.[73] The A8 is manufactured on a 20 nm process[74] by TSMC,[75] which replaced Samsung as the manufacturer of Apple's mobile device processors. It contains 2 billion transistors. Despite that being double the number of transistors compared to the A7, its physical size has been reduced by 13% to 89 mm2 (consistent with a shrink only, not known to be a new microarchitecture).[76]
Apple A8X
The Apple A8X is a 64-bit SoC introduced at the launch of the iPad Air 2 on October 16, 2014.[77] It is a high performance variant of the Apple A8. Apple states that it has 40% more CPU performance and 2.5 times the graphics performance of its predecessor, the Apple A7.[77][78]
Unlike the A8, this SoC uses a triple-core CPU, a new octa-core GPU, dual channel memory and slightly higher 1.5 GHz CPU clock rate.[79] It uses an integrated custom octa-core PowerVR GXA6850 graphics processing unit (GPU) running at 450 MHz and a dual-channel memory subsystem.[79] It is manufactured by TSMC on their 20 nm fabrication process, and consists of 3 billion transistors.
Apple A9
The Apple A9 is a 64-bit ARM-based SoC that first appeared in the iPhone 6S and 6S Plus, which were introduced on September 9, 2015.[80] Apple states that it has 70% more CPU performance and 90% more graphics performance compared to its predecessor, the Apple A8.[80] It is dual sourced, a first for an Apple SoC; it is manufactured by Samsung on their 14 nm FinFET LPE process and by TSMC on their 16 nm FinFET process. It was subsequently included in the first-generation iPhone SE, and the iPad (5th generation). The Apple A9 was the last CPU that Apple manufactured through a contract with Samsung, as all A-series chips after are manufactured by TSMC.
Apple A9X
The Apple A9X is a 64-bit SoC that was announced on September 9, 2015, and released on November 11, 2015, and first appeared in the iPad Pro.[81] It offers 80% more CPU performance and two times the GPU performance of its predecessor, the Apple A8X. It is manufactured by TSMC using a 16 nm FinFET process.[82]
Apple A10 Fusion
The Apple A10 Fusion is a 64-bit ARM-based SoC that first appeared in the iPhone 7 and 7 Plus, which were introduced on September 7, 2016.[83] The A10 is also featured in the sixth-generation iPad, seventh-generation iPad and seventh-generation iPod Touch.[84] It has a new ARM big.LITTLE quad core design with two high performance cores, and two smaller highly efficient cores. It is 40% faster than the A9, with 50% faster graphics. It is manufactured by TSMC on their 16 nm FinFET process.
Apple A10X Fusion
The Apple A10X Fusion is a 64-bit ARM-based SoC that first appeared in the 10.5" iPad Pro and the second generation of the 12.9" iPad Pro, which were both announced on June 5, 2017.[85] It is a variant of the A10 and Apple claims that it has 30 percent faster CPU performance and 40 percent faster GPU performance than its predecessor, the A9X.[85] On September 12, 2017, Apple announced that the Apple TV 4K would be powered by an A10X chip. It is made by TSMC on their 10 nm FinFET process.[86]
Apple A11 Bionic
The Apple A11 Bionic is a 64-bit ARM-based SoC[87] that first appeared in the iPhone 8, iPhone 8 Plus, and iPhone X, which were introduced on September 12, 2017.[87] It has two high-performance cores, which are 25% faster than the A10 Fusion, four high-efficiency cores, which are 70% faster than the energy-efficient cores in the A10, and for the first time an Apple-designed three-core GPU with 30% faster graphics performance than the A10.[87][88] It is also the first A-series chip to feature Apple's "Neural Engine," which enhances artificial intelligence and machine learning processes.[89]
Apple A12 Bionic
The Apple A12 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone XS, XS Max and XR, which were introduced on September 12, 2018. It is also used in the third-generation iPad Air, fifth-generation iPad Mini, and the eighth-generation iPad. It has two high-performance cores, which are 15% faster than the A11 Bionic, and four high-efficiency cores, which have 50% lower power usage than the energy-efficient cores in the A11 Bionic.[90] The A12 is manufactured by TSMC[91] using a 7 nm[92] FinFET process, the first to ship in a smartphone.[93][91] It is also used in the 6th generation Apple TV.
Apple A12X Bionic
The Apple A12X Bionic is a 64-bit ARM-based SoC that first appeared in the 11.0" iPad Pro and the third generation of the 12.9" iPad Pro, which were both announced on October 30, 2018.[94] It offers 35% faster single-core and 90% faster multi-core CPU performance than its predecessor, the A10X. It has four high-performance cores and four high-efficiency cores. The A12X is manufactured by TSMC using a 7 nm FinFET process.
Apple A12Z Bionic
The Apple A12Z Bionic is an updated version the A12X Bionic, first appearing in the fourth generation iPad Pro, which was announced on March 18, 2020.[95] It adds an additional GPU core, compared to the A12X, for improved graphics performance.[96] The A12Z is also used in the Developer Transition Kit prototype computer that helps developers prepare their software for Macs based on Apple silicon.[97]
Apple A13 Bionic
The Apple A13 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 11, 11 Pro, and 11 Pro Max, which were introduced on September 10, 2019. It is also featured in the second-generation iPhone SE (released April 15, 2020), the 9th generation iPad (announced September 14, 2021) and in the Studio Display (announced March 8, 2022)
The entire A13 SoC features a total of 18 cores – a six-core CPU, four-core GPU, and an eight-core Neural Engine processor, which is dedicated to handling on-board machine learning processes; four of the six cores on the CPU are low-powered cores that are dedicated to handling less CPU-intensive operations, such as voice calls, browsing the Web, and sending messages, while two higher-performance cores are used only for more CPU-intensive processes, such as recording 4K video or playing a video game.[98]
Apple A14 Bionic
The Apple A14 Bionic is a 64-bit ARM-based SoC that first appeared in the fourth-generation iPad Air and iPhone 12, released on October 23, 2020. It is the first commercially available 5 nm chipset and it contains 11.8 billion transistors and a 16-core AI processor.[99] It includes Samsung LPDDR4X DRAM, a 6-core CPU, and 4-Core GPU with real time machine learning capabilities.
Apple A15 Bionic
The Apple A15 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 13, unveiled on September 14, 2021. The A15 is built on a 5-nanometer manufacturing process with 15 billion transistors. It has 2 high-performance processing cores, 4 high-efficiency cores, a new 5-core graphics for iPhone 13 Pro series (4-core for iPhone 13&13 mini) processing unit, and a new 16-core Neural Engine capable of 15.8 trillion operations per second.[100][101] It is also used in the iPhone 14 and iPhone 14 Plus.[102]
Apple A16 Bionic
The Apple A16 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 14 Pro, unveiled on September 7, 2022. The A16 is built on an enhanced 5-nanometer manufacturing process (referred to as N4 or commonly 4nm node)[103][104] with 16 billion transistors. It has 2 high-performance processing cores, 4 high-efficiency cores and 5-core graphics for iPhone 14 Pro series. Memory is upgraded to LPDDR5 for 50% higher bandwidth and a 7% faster 16-core Neural Engine capable of 17 trillion operations per second.
List of processors
General | Image | Semiconductor technology | Computer architecture | CPU | GPU | AI accelerator | Memory technology | First released date | Utilizing devices | Supported OS | |||||||||||||||||||||||||||
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Name | Codename | Part No. | Node | Manufacturer | Transistors count | Die size | CPU ISA | Bit width | Performance core | Efficiency core | Overall cores | Cache | Vendor | Cores | EU count | ALU count | Frequency | FLOPS | Cores | OPS | Memory bus width | Total channel Bit per channel |
Memory type | Theoretical bandwidth |
Available capacity | Initial | Terminal | ||||||||||
Core name | Cores | Core speed | Core name | Cores | Core speed | L1 | L2 | L3 | SLC | ||||||||||||||||||||||||||||
[a] | APL0098 | S5L8900 | 90 nm [105] |
Samsung | 72 mm2 [13] |
ARMv6 | 32-bit | ARM11 | 1 | 412 MHz | — | — | — | Single-core | L1i: 16 KB L1d: 16 KB |
— | — | — | PowerVR MBX Lite | 1 | 1 | 8 | 60 MHz - 103 MHz | 0.96 GFLOPS - 1.64 GFLOPS | — | — | 16-bit | 1 channel 16-bit/channel |
LPDDR-266 (133 MHz) |
533 MB/s | 128 MB | June 29, 2007 |
|
iPhone OS 1.0 | iPhone OS 3.1.3[b] iOS 4.2.1[c] | ||
[d] | APL0278 | S5L8720 | 65 nm [13] |
36 mm2 [13] |
533 MHz | 103 MHz - 133 MHz | 1.64 GFLOPs - 2.12 GFLOPS | 32-bit | 1 channel 32-bit/channel |
1066 MB/s | September 9, 2008 |
|
iPhone OS 2.1.1 | ||||||||||||||||||||||||
[e] | APL0298 | S5L8920 | 71.8 mm2 [14] |
ARMv7 | Cortex-A8 | 600 MHz | L1i: 32 KB L1d: 32 KB |
256 KB | PowerVR SGX535[106] | 2 | 16 | 200 MHz | 6.4 GFLOPS | LPDDR-400 (200 MHz) |
1.6 GB/s | 256 MB | June 19, 2009 | iPhone OS 3.0 | iOS 6.1.6 | ||||||||||||||||||
APL2298 | S5L8922 | 45 nm [13][14][35] |
41.6 mm2 [13] |
September 9, 2009 |
|
iPhone OS 3.1.1 | iOS 5.1.1 | ||||||||||||||||||||||||||||||
A4 | APL0398 | S5L8930 | 53.3 mm2 [13][14] |
800 MHz | 512 KB | 200 MHz - 250 MHz | 6.4 GFLOPS - 8.0 GFLOPS | 64-bit | 2 channels 32-bit/channel |
3.2 GB/s | April 3, 2010 |
|
iPhone OS 3.2 Apple TV Software 4.0 |
iOS 6.1.6 | |||||||||||||||||||||||
1.0 GHz |
|
iOS 5.1.1[f] Apple TV Software 6.2.1 | |||||||||||||||||||||||||||||||||||
800 MHz | 512 MB | iOS 7.1.2 | |||||||||||||||||||||||||||||||||||
A5 | APL0498 | S5L8940 | 122.2 mm2 [35] |
Cortex-A9 | 2 | 800 MHz | Dual-core | 1 MB | PowerVR SGX543[107][53] | 2 | 4 | 32 | 200 MHz | 12.8 GFLOPS | LPDDR2-800 (400 MHz) |
6.4 GB/s | March 11, 2011 | iOS 4.3 | iOS 9.3.5[g] iOS 9.3.6[h] Apple TV Software 7.6.2 | ||||||||||||||||||
1.0 GHz |
| ||||||||||||||||||||||||||||||||||||
APL2498 | S5L8942 | 32 nm Hκ MG [36][42] |
69.6 mm2 [36] |
800 MHz | March 7, 2012 | iOS 5.1 | |||||||||||||||||||||||||||||||
1.0 GHz |
| ||||||||||||||||||||||||||||||||||||
2 (One core locked) | Dual-core Single-core in actual |
|
Apple TV Software 5.0 | ||||||||||||||||||||||||||||||||||
APL7498 | S5L8947 | 37.8 mm2 [42] |
1 | Single-core | January 28, 2013 |
|
Apple TV Software 5.2 | ||||||||||||||||||||||||||||||
A5X | APL5498 | S5L8945 | 45 nm [13][14][35] |
165 mm2 [44] |
2 | Dual-core | 4 | 8 | 64 | 25.6 GFLOPS | 128-bit | 4 channels 32-bit/channel |
12.8 GB/s | 1 GB | March 16, 2012 | iOS 5.1 | |||||||||||||||||||||
A6 | APL0598 | S5L8950 | 32 nm Hκ MG [54][108][57] |
96.71 mm2 [54][108] |
ARMv7s[109] | Swift[51] | 1.3 GHz[110] | 3 | 6 | 48 | 266 MHz | 68.0 GFLOPS | 64-bit | 2 channels 32-bit/channel |
LPDDR2-1066 (533 MHz) |
8.5 GB/s | September 21, 2012 | iOS 6.0 | iOS 10.3.3[i] iOS 10.3.4[j] | ||||||||||||||||||
A6X | APL5598 | S5L8955 | 123 mm2 [57] |
1.4 GHz[56] | PowerVR SGX554[56][111] | 4 | 16 | 128 | 300 MHz | 76.8 GFLOPS | 128-bit | 4 channels 32-bit/channel |
17.0 GB/s | November 2, 2012 | |||||||||||||||||||||||
A7 | APL0698 | S5L8960 | 28 nm Hκ MG [67][112] |
1 billion | 102 mm2 [62][112] |
ARMv8.0-A [63][71] |
64-bit | Cyclone | 1.3 GHz | L1i: 64 KB L1d: 64 KB |
4 MB (Inclusive) [63][113][61] |
PowerVR G6430[65][111] | 450 MHz | 115.2 GFLOPS | 64-bit | 1 channel 64-bit/channel |
LPDDR3-1600 (800 MHz) |
12.8 GB/s | September 20, 2013 | iOS 7.0 | iOS 12.5.5 | ||||||||||||||||
APL5698 | S5L8965 | 1.4 GHz | November 1, 2013 |
|
iOS 7.0.3 | ||||||||||||||||||||||||||||||||
A8 | APL1011 | T7000 | 20 nm Hκ MG [72][71] |
TSMC | 2 billion | 89 mm2 [114][79] [115] |
Typhoon | 1.1 GHz | PowerVR GX6450[73][116][117] | 533 MHz | 136.4 GFLOPS | September 19, 2014 | iOS 8.0 | ||||||||||||||||||||||||
1.4 GHz | |||||||||||||||||||||||||||||||||||||
audioOS 11.0 | HomePod Software 15.6 (Current) | ||||||||||||||||||||||||||||||||||||
1.5 GHz | 2 GB | iOS 8.0 tvOS 9.0 |
iOS 15.6 (Current) iPadOS 15.6 (Current) tvOS 15.6 (Current) | ||||||||||||||||||||||||||||||||||
A8X | APL1021 | T7001 | 3 billion | 128 mm2 [79] |
3 | 1.5 GHz | 3-core | 2 MB | PowerVR GX6850[73][79][115] | 8 | 32 | 256 | 450 MHz | 230.4 GFLOPS | 128-bit | 2 channels 64-bit/channel |
25.6 GB/s | October 22, 2014 | iOS 8.1 | ||||||||||||||||||
A9 | APL0898 | S8000 | 14 nm FinFET [118] |
Samsung | ≥ 2 billion | 96 mm2 [119] |
Twister | 2 | 1.85 GHz[120][121] | Dual-core | 3 MB | 4 MB (Victim) | PowerVR GT7600[73][123] | 6 | 24 | 192 | 650 MHz | 249.6 GFLOPS | 64-bit | 1 channel 64-bit/channel |
LPDDR4-3200 (1600 MHz) |
September 25, 2015 | iOS 9.0 | ||||||||||||||
APL1022 | S8003 | 16 nm FinFET [119][124][125] |
TSMC | 104.5 mm2 [119] | |||||||||||||||||||||||||||||||||
A9X | APL1021 | S8001 | ≥ 3 billion | 143.9 mm2 [124][86] |
2.16 GHz[126][127] | —[113][124] | PowerVR GT7850[73][124] | 12 | 48 | 384 | 650 MHz | 499.2 GFLOPS | 128-bit (64-bit in actual) |
2 channels (one channel is unused) 64-bit/channel |
November 11, 2015 |
|
iOS 9.1 | ||||||||||||||||||||
2.26 GHz | 128-bit | 2 channels 64-bit/channel |
51.2 GB/s | 4 GB |
| ||||||||||||||||||||||||||||||||
A10 Fusion | APL1W24 | T8010 | 3.3 billion | 125 mm2 [125] |
ARMv8.1-A | Hurricane | 2 | 1.64 GHz | Zephyr | 2 | 1.09 GHz | Quad-core (Only 2 cores performed at a same time) |
P-core: L1i: 64 KB L1d: 64 KB E-core: L1i: 32 KB L1d: 32KB |
P-core: 3 MB E-core: 1 MB |
4 MB | PowerVR GT7600 Plus[128][73][129][130] | 6 | 24 | 192 | 900 MHz | 345.6 GFLOPS | 64-bit | 1 channel 64-bit/channel |
25.6 GB/s | 2 GB | September 16, 2016 | iOS 10.0 | ||||||||||
2.34 GHz | |||||||||||||||||||||||||||||||||||||
3 GB | |||||||||||||||||||||||||||||||||||||
A10X Fusion | APL1071 | T8011 | 10 nm FinFET [86] |
≥ 4 billion | 96.4 mm2 [86] |
3 | 2.38 GHz | 3 | 1.30 GHz | 6-core (Only 3 cores performed at a same time) |
P-core: 8 MB E-core: 1 MB |
—[131][132] | 4 MB | 12 | 48 | 384 | 1000 MHz | 768.0 GFLOPS | 128-bit | 2 channels 64-bit/channel |
51.2 GB/s | 3 GB | June 13, 2017 | tvOS 11.0 | |||||||||||||
4 GB | iOS 10.3.2 | ||||||||||||||||||||||||||||||||||||
A11 Bionic |
APL1W72 | T8015 | 4.3 billion | 87.66 mm2 [133] |
ARMv8.2-A[134] | Monsoon | 2 | 2.39 GHz | Mistral | 4 | 1.19 GHz | 6-core | First generation Apple-designed | 3 | 24 | 192 | 1066 MHz | 409.3 GFLOPS | 2 | 600 billion OPS | 64-bit | 1 channel 64-bit/channel |
LPDDR4X-4266 (2133 MHz) |
34.1 GB/s | 2 GB | September 22, 2017 | iOS 11.0 | ||||||||||
3 GB | |||||||||||||||||||||||||||||||||||||
A12 Bionic |
APL1W81 | T8020 | 7 nm FinFET (N7) |
6.9 billion | 83.27 mm2 [135] |
ARMv8.3-A[136] | Vortex | 2.49 GHz | Tempest | 1.59 GHz | P-core: L1i: 128 KB L1d: 128 KB E-core: L1i: 32 KB L1d: 32KB |
P-core: 8 MB E-core: 2 MB |
8 MB | Second generation Apple-designed | 4 | 32 | 256 | 1125 MHz | 576.0 GFLOPS | 8 | 5 TOPS | September 21, 2018 | iOS 12.0 tvOS 14.5 | ||||||||||||||
4 GB | |||||||||||||||||||||||||||||||||||||
A12X Bionic | APL1083 | T8027 | 10 billion | 135 mm2 [137] |
4 | 8-core | 7 |
56 | 448 | 1340 MHz | 1.20 TFLOPS | 128-bit | 2 channels 64-bit/channel |
68.2 GB/s | November 7, 2018 | iOS 12.1 | |||||||||||||||||||||
6 GB | |||||||||||||||||||||||||||||||||||||
A12Z Bionic | 8 | 64 | 512 | 1.37 TFLOPS | March 25, 2020 | iPadOS 13.4 | |||||||||||||||||||||||||||||||
16 GB | June 22, 2020 | macOS Big Sur 11.0 Beta 1 | macOS Big Sur 11.3 Beta 2 | ||||||||||||||||||||||||||||||||||
A13 Bionic |
APL1W85 | T8030 | 7 nm FinFET (N7P) |
8.5 billion | 98.48 mm2 [138] |
ARMv8.4-A[139] | Lightning | 2 | 2.65 GHz | Thunder | 1.72 GHz | 6-core | P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 96 KB L1d: 48 KB |
P-core: 8 MB E-core: 4 MB |
16 MB | Third generation Apple-designed[140] | 4 | 32 | 256 | 1350 MHz | 691.2 GFLOPS | 5.5 TOPS | 64-bit | 1 channel 64-bit/channel |
34.1 GB/s | 3 GB | September 20, 2019 | iOS 13.0 iPadOS 13.0 |
iOS 15.6 (Current) iPadOS 15.6 (Current) tvOS 15.6 (Current) | ||||||||
4 GB | |||||||||||||||||||||||||||||||||||||
A14 Bionic |
APL1W01 | T8101 | 5 nm FinFET (N5) |
11.8 billion | 88 mm2 [141] |
ARMv8.5-A | Firestorm | 3.09 GHz | Icestorm | 1.82 GHz | P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 128 KB L1d: 64 KB |
Fourth generation Apple-designed[142][140][143][144] | 64 | 512 | 1000 MHz | 1.0 TFLOPS | 16 | 11 TOPS | October 23, 2020 | iOS 14.0 iPadOS 14.0 | |||||||||||||||||
6 GB | |||||||||||||||||||||||||||||||||||||
A15 Bionic |
APL1W07 [145] |
T8110 | 5 nm FinFET (N5P) |
15 billion | 107.68 mm2[145] | Avalanche | 3.23 GHz | Blizzard | 2.02 GHz | P-core: 12 MB E-core: 4 MB |
32 MB | Fifth generation Apple-designed[146][147][148] | TBC | TBC | TBC | 1.2 TFLOPS | 15.8 TOPS | 4 GB | September 24, 2021 | iOS 15.0 iPadOS 15.0 | |||||||||||||||||
2.93 GHz | 5 | TBC | TBC | 1.5 TFLOPS | |||||||||||||||||||||||||||||||||
3.23 GHz | 6 GB | ||||||||||||||||||||||||||||||||||||
A16 Bionic |
4 nm FinFET (N4)[103][104] |
16 billion | 3.46 GHz | Sixth generation Apple-designed | TBC | TBC | TBC | 16 | 17 TOPS | LPDDR5-6400 | September 7, 2022 | iOS 16.0 | iOS 16.0 | ||||||||||||||||||||||||
Name | Codename | Part No. | Image | Node | Manufacturer | Transistors count | Die size | CPU ISA | Bit width | Core name | Cores | Core speed | Core name | Cores | Core speed | Overall cores | L1 | L2 | L3 | SLC | Vendor | Cores | EU count | ALU count | Frequency | FLOPS | Cores | OPS | Memory bus width | Total channel Bit per channel |
Memory type | Theoretical bandwidth |
Available capacity | First released date | Utilizing devices | Initial | Terminal |
Performance core | Efficiency core | Cache | |||||||||||||||||||||||||||||||||||
General | Semiconductor technology | Computer architecture | CPU | GPU | AI accelerator | Memory technology | Supported OS |
H series
The Apple "H" series is a family of SoCs used in headphones. "H" in model numbers stands for headphones.
Apple H1
The Apple H1 chip was first used in the 2019 version of AirPods, and was later used in the Powerbeats Pro, the Beats Solo Pro, the AirPods Pro, the 2020 Powerbeats, AirPods Max,[149] and the AirPods (3rd generation). Specifically designed for headphones, it has Bluetooth 5.0, supports hands-free "Hey Siri" commands,[150] and offers 30 percent lower latency than the W1 chip used in earlier AirPods.[151]
Apple H2
The Apple H2 chip was first used in the 2022 version of AirPods Pro. It has Bluetooth 5.3, and reduces noise at 48,000 times per second.
List of processors
Name | Model no. | Image | Bluetooth | First Released | Utilizing devices |
---|---|---|---|---|---|
H1 | 343S00289[152] (AirPods 2nd Generation) 343S00290[153] (AirPods 2nd Generation) 343S00404[154] (AirPods Max) H1 SiP[155] (AirPods Pro) |
|
5.0 | March 20, 2019 |
|
H2 | 5.3 | September 7, 2022 |
|
M series
Evolution of Apple "M" series | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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The Apple "M" series is a family of systems on a chip (SoC) used in Mac computers from November 2020 or later, iPad Pro tablets from April 2021 or later, and iPad Air tablets from March 2022 or later. The "M" designation was previously used for Apple motion coprocessors.
Apple M1
Apple M1
The M1, Apple's first system on a chip designed for use in Macs, is manufactured using TSMC's 5 nm process. Announced on November 10, 2020, it is used in the MacBook Air (M1, 2020), Mac mini (M1, 2020), MacBook Pro (13-inch, M1, 2020), iMac (24-inch, M1, 2021), iPad Pro (5th generation) and iPad Air (5th generation). It comes with 4 performance cores and 4 efficiency cores, for a total of 8 CPU cores. It comes with up to 8 GPU cores, with the entry level MacBook Air having only 7 GPU cores. The M1 has 16 billion transistors.[157]
Apple M1 Pro
The M1 Pro is a more powerful version of the M1, with six to eight performance cores, two efficiency cores, 14 to 16 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and more than double the transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro. Apple said the CPU performance is about 70% faster than the M1, and that its GPU performance is about double. Apple claims the M1 Pro can deliver up to 20 streams of 4K or 7 streams of 8K ProRes video playback (up from 6 offered by Afterburner card for 2019 Mac Pro).
Apple M1 Max
The M1 Max is a larger version of the M1 Pro chip, with eight performance cores, two efficiency cores, 24 to 32 GPU cores, 16 Neural Engine cores, up to 64 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the number of transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro, as well as the Mac Studio. Apple says it has 57 billion transistors.[158] Apple claims the M1 Max can deliver up to 30 streams of 4K (up from 23 offered by Afterburner card for 2019 Mac Pro) or 7 streams of 8K ProRes video playback.
Apple M1 Ultra
The M1 Ultra consists of two M1 Max dies connected together by a silicon interposer through Apple's UltraFusion technology.[159] It has 114 billion transistors, 16 performance cores, 4 efficiency cores, 48 to 64 GPU cores and 32 Neural Engine cores; it can be configured with up to 128 GB unified RAM of 800 GB/s memory bandwidth. It was announced on March 8, 2022, as an optional upgrade for the Mac Studio. Apple claims the M1 Ultra can deliver up to 18 streams of 8K ProRes video playback.[160]
Apple M2
Apple announced the M2 SoC on June 6, 2022, at WWDC, along with the new MacBook Air and the new 13-inch MacBook Pro. It is the successor to the Apple M1. The M2 is made with TSMC's "Enhanced 5-nanometer technology" N5P process and contains 20 billion transistors, a 25% increase from the previous generation M1. The M2 can be configured with up to 24 gigabytes of RAM and 2 terabytes of storage. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. The M2 also increases the memory bandwidth to 100 GB/s. Apple claims CPU improvements up to 18% and GPU improvements up to 35% compared to the previous M1.[161]
List of processors
General | Image | Semiconductor technology | Computer architecture | CPU | GPU | AI accelerator | Memory technology | Connectivity | First released date | Utilizing devices | Supported OS | ||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Name | Codename | Part No. | Node | Manufacturer | Transistors count | Die size | CPU ISA | Bit width | Performance core | Efficiency core | Overall cores | Cache | Vendor | Cores | EU count | ALU count | Frequency | FLOPS | Cores | OPS | Memory bus width | Total channel Bit per channel |
Memory type | Theoretical bandwidth |
Available capacity | Ports | External display | Initial | Terminal | ||||||||||||
Core name | Cores | Core speed | Core name | Cores | Core speed | L1 | L2 | L3 | SLC | Thunderbolt | USB | Max | |||||||||||||||||||||||||||||
M1 | APL1102 | T8103 | 5 nm FinFET (N5) | TSMC | 16 billion | 118.91 mm2 [162] |
ARMv8.5-A | 64-bit | Firestorm | 4 | 3.20 GHz | Icestorm | 4 | 2.06 GHz | 8-core | P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 128 KB L1d: 64 KB |
P-core: 12 MB E-core: 4 MB |
— | 8 MB | Fourth generation Apple-designed | 7 | 112 | 896 | 1278 MHz | 2.29 TFLOPS | 16 | 11 TOPS | 128-bit | 2 channels 64-bit/channel |
LPDDR4X-4266 (2133 MHz) |
68.2 GB/s | 8 GB 16 GB[k] |
Thunderbolt 3 (Up to 40 Gbit/s)[l] |
USB4 (Up to 40 Gbit/s)[m] USB 3.1 Gen 2 (Up to 10 Gbit/s) |
iPad: 1 Thunderbolt/USB4[n] MacBook and Mac Desktop: 2 Thunderbolt/USB4 iMac (4 ports): Additional 2 USB-C Mac mini: Additional 2 USB-A and 1 HDMI 2.0 |
All: One 6016 x 3384 at 60 Hz at 8-bit color depth display Mac mini: One 6016 x 3384 at 60 Hz at 8-bit color depth display and one 3840 x 2160 at 60 Hz at 8-bit color depth display |
November 17, 2020 |
|
macOS Big Sur 11.0 iPadOS 14.5 |
macOS Monterey 12.5 (Current) iPadOS 15.6 (Current) | |
8 | 128 | 1024 | 2.61 TFLOPS |
| |||||||||||||||||||||||||||||||||||||
M1 Pro | APL1103 | T6000 | 33.7 billion | ≈ 245 mm2 [163] |
6 | 3.23 GHz | 2 | P-core: 24 MB E-core: 4 MB |
24 MB | 14 | 224 | 1792 | 1296 MHz | 4.58 TFLOPS | 256-bit | 2 channels 128-bit/channel |
LPDDR5-6400 (3200 MHz) |
204.8 GB/s | 16 GB 32 GB[o] |
Thunderbolt 4 (Up to 40 Gbit/s) |
MacBook: 3 Thunderbolt 4, 1 SDXC slot and 1 HDMI 2.0 |
Two 6016 x 3384 at 60 Hz at 10-bit color depth displays | October 26, 2021 |
|
macOS Monterey 12.0 | macOS Monterey 12.5 (Current) | |||||||||||||||
8 | 10-core | ||||||||||||||||||||||||||||||||||||||||
16 | 256 | 2048 | 5.30 TFLOPS |
| |||||||||||||||||||||||||||||||||||||
M1 Max | APL1105[164] | T6001 | 57 billion | ≈ 432 mm2 [163] |
48 MB | 24 | 384 | 3072 | 7.83 TFLOPS | 512-bit | 4 channels 128-bit/channel |
409.6 GB/s | 32 GB 64 GB[p] |
MacBook: 3 Thunderbolt 4, 1 SDXC slot and 1 HDMI 2.0 Mac Studio: 4 Thunderbolt 4, 2 USB-C, 1 SDXC slot and 1 HDMI 2.0 |
MacBook: Three 6016 x 3384 at 60 Hz at 10-bit color depth displays and one 3840 x 2160 at 60 Hz at 10-bit color depth display Mac Studio: Four 6016 x 3384 at 60 Hz at 10-bit color depth displays and one 3840 x 2160 at 60 Hz at 10-bit color depth display |
| |||||||||||||||||||||||||
32 | 512 | 4096 | 10.6 TFLOPS | ||||||||||||||||||||||||||||||||||||||
M1 Ultra | APL1W06 | T6002 | 114 billion | ≈ 864 mm2 | 16 | 4 | 20-core | P-core: 48 MB E-core: 8 MB |
96 MB | 48 | 768 | 6144 | 15.7 TFLOPS | 32 | 22 TOPS | 1024-bit | 8 channels 128-bit/channel |
819.2 GB/s | 64 GB 128 GB[q] |
6 Thunderbolt 4, 1 SDXC slot and 1 HDMI 2.0 | Four 6016 x 3384 at 60 Hz at 10-bit color depth displays and one 3840 x 2160 at 60 Hz at 10-bit color depth display |
March 18, 2022 |
|
macOS Monterey 12.3 | |||||||||||||||||
64 | 1024 | 8192 | 21.2 TFLOPS | ||||||||||||||||||||||||||||||||||||||
M2 | APL1109 | T8112 | 5 nm FinFET (N5P) | 20 billion | 155.25 mm2 [162] |
Avalanche | 4 | 3.49 GHz | Blizzard | 4 | 2.42 GHz | 8-core | P-core: 16 MB E-core: 4 MB |
8 MB | Fifth generation Apple-designed | 8 | TBC | TBC | TBC | 2.88 TFLOPS | 16 | 15.8 TOPS | 128-bit | 2 channels 64-bit/channel |
102.4 GB/s | 8 GB 16 GB[r] 24 GB[s] |
Thunderbolt 3 (Up to 40 Gbit/s) |
2 Thunderbolt/USB4 | One 6016 x 3384 at 60 Hz at 8-bit color depth display | July 15, 2022 |
|
macOS Monterey 12.5 | |||||||||
10 | TBC | TBC | 3.6 TFLOPS | June 24, 2022 |
| ||||||||||||||||||||||||||||||||||||
Name | Codename | Part No. | Image | Node | Manufacturer | Transistors count | Die size | CPU ISA | Bit width | Core name | Cores | Core speed | Core name | Cores | Core speed | Overall cores | L1 | L2 | L3 | SLC | Vendor | Cores | EU count | ALU count | Frequency | FLOPS | Cores | OPS | Memory bus width | Total channel Bit per channel |
Memory type | Theoretical bandwidth |
Available capacity | Thunderbolt | USB | Max | External display | First released date | Utilizing devices | Initial | Terminal |
Performance core | Efficiency core | Cache | Ports | ||||||||||||||||||||||||||||||||||||||
General | Semiconductor technology | Computer architecture | CPU | GPU | AI accelerator | Memory technology | Connectivity | Supported OS |
S series
Evolution of Apple "S" series | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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The Apple "S" series is a family of systems in a package (SiP) used in the Apple Watch. It uses a customized application processor that together with memory, storage and support processors for wireless connectivity, sensors, and I/O form a complete computer in a single package. They are designed by Apple and manufactured by contract manufacturers such as Samsung.
Apple S1
The Apple S1 is an integrated computer. It includes memory, storage and support circuits like wireless modems and I/O controllers in a sealed integrated package. It was announced on September 9, 2014, as part of the "Wish we could say more" event. It was used in the first-generation Apple Watch.[165]
Apple S1P
Used in Apple Watch Series 1. It has a dual-core processor identical to the S2, with the exception of the built-in GPS receiver. It contains the same dual-core CPU with the same new GPU capabilities as the S2, making it about 50% faster than the S1.[166][167]
Apple S2
Used in the Apple Watch Series 2. It has a dual-core processor and a built-in GPS receiver. The S2's two cores deliver 50% higher performance and the GPU delivers twice as much as the predecessor,[168] and is similar in performance to the Apple S1P.[169]
Apple S3
Used in the Apple Watch Series 3. It has a dual-core processor that is 70% faster than the Apple S2 and a built-in GPS receiver.[170] There is also an option for a cellular modem and an internal eSIM module.[170] It also includes the W2 chip.[170] The S3 also contains a barometric altimeter, the W2 wireless connectivity processor, and in some models UMTS (3G) and LTE (4G) cellular modems served by a built-in eSIM.[170]
Apple S4
Used in the Apple Watch Series 4. It has a custom 64-bit dual-core processor based on the A12 with up to 2× faster performance. It also contains the W3 wireless chip, which supports Bluetooth 5. The S4 introduced 64-bit ARMv8 cores to the Apple Watch. The chip contains two Tempest cores,[171][172] which are the energy-efficient cores found in the A12. Despite the small size, Tempest still uses a 3-wide decode out-of-order superscalar design, which make them much more powerful than previous in-order cores.
The S4 contains a Neural Engine that is able to run Core ML.[173] Third-party apps can use it starting from watchOS 6. The SiP also includes new accelerometer and gyroscope functionality that has twice the dynamic range in measurable values of its predecessor, as well as being able to sample data at 8 times the speed.[174] It also contains a new custom GPU, which can use the Metal API.[175]
Apple S5
Used in the Apple Watch Series 5, Watch SE, and HomePod mini.[176] It adds a built-in magnetometer to the custom 64-bit dual-core processor and GPU of the S4.[177]
Apple S6
Used in the Apple Watch Series 6. It has a custom 64-bit dual-core processor that runs up to 20 percent faster than the S5.[178][179] The dual cores in the S6 are based on the A13's energy-efficient "little" Thunder cores at 1.8 GHz.[180] Like the S4 and S5, it also contains the W3 wireless chip.[179] The S6 adds the new U1 ultra wideband chip, an always-on altimeter, and 5 GHz WiFi.[178][179]
Apple S7
Used in the Apple Watch Series 7. The S7 has the same T8301 identifier and quoted performance as the S6.[181]
Apple S8
Used in the Apple Watch SE (2nd generation), Watch Series 8, and Watch Ultra. The S8 adds a new three-axis gyroscope and high g-force accelerometer.[182]
List of processors
Name | Model no. | Image | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | GPU | Memory technology | Modem | First Released | Utilizing devices | Initial OS | Terminal OS |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
S1 | APL 0778 [183] |
28 nm Hκ MG[184][185] | 32 mm2[184] | ARMv7k[185][186] | 520 MHz single-core Cortex-A7[185] | L1d: 32 KB[185] L2: 256 KB[185] |
PowerVR Series 5[185][187] | LPDDR3[188] | April 2015 | watchOS 1.0 | watchOS 4.3.2 | |||
S1P | TBC | TBC | ARMv7k[189][190][168] | 520 MHz dual-core Cortex-A7 without GPS[189] | TBC | PowerVR Series 6 'Rogue'[189] | LPDDR3 | September 2016 | watchOS 3.0 | watchOS 6.3 | ||||
S2 | 520 MHz dual-core Cortex-A7[189] | |||||||||||||
S3 | ARMv7k[191] | Dual-core | TBC | LPDDR4 | Qualcomm MDM9635M (Snapdragon X7 LTE) | September 2017 | watchOS 4.0 | watchOS 8.7.1 (Current) | ||||||
S4 | 7 nm (TSMC N7) | TBC | ARMv8-A ILP32[192][193] | 1.59 GHz Dual-core Tempest | TBC | Apple G11M[193] | TBC | September 2018 | watchOS 5.0 | watchOS 8.7 (Current)
audioOS 15.6 (Current) | ||||
S5 | September 2019 | watchOS 6.0
audioOS 14.2 | ||||||||||||
S6 | 7 nm (TSMC N7P) | TBC | 1.8 GHz Dual-core Thunder | TBC | September 2020 | watchOS 7.0 | ||||||||
S7 | October 2021 | watchOS 8.0 | ||||||||||||
Name | Model no. | Image | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | GPU | Memory technology | Modem | First Released | Utilizing devices | Initial OS | Terminal OS |
T series
The T series chip operates as a secure enclave on Intel-based MacBook and iMac computers released from 2016 onwards. The chip processes and encrypts biometric information (Touch ID) and acts as a gatekeeper to the microphone and FaceTime HD camera, protecting them from hacking. The chip runs bridgeOS, a purported variant of watchOS.[194] The functions of the T series processor were built into the M series CPUs, thus ending the need for the T series.
Apple T1
The Apple T1 chip is an ARMv7 SoC (derived from the processor in the Apple Watch's S2) that drives the System Management Controller (SMC) and Touch ID sensor of the 2016 and 2017 MacBook Pro with Touch Bar.[195]
Apple T2
The Apple T2 security chip is a SoC first released in the iMac Pro. It is a 64-bit ARMv8 chip (a variant of the A10 Fusion, or T8010), and runs bridgeOS 2.0.[196][197] It provides a secure enclave for encrypted keys, enables users to lock down the computer's boot process, handles system functions like the camera and audio control, and handles on-the-fly encryption and decryption for the solid-state drive.[198][199][200] T2 also delivers "enhanced imaging processing" for the iMac Pro's FaceTime HD camera.[201][202]
List of processors
Name | Model no. | Image | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | GPU | Memory technology | First Released | Utilizing devices |
---|---|---|---|---|---|---|---|---|---|---|---|
Memory bandwidth | |||||||||||
T1 | APL 1023 [203] |
Same as S2 | TBC | ARMv7 | TBD | November 12, 2016 |
|||||
T2 | APL 1027 [204] |
TSMC 16 nm FinFET.[205] | 104 mm2[205] | ARMv8-A ARMv7-A |
2× Hurricane 2× Zephyr + Cortex-A7 |
L1i: 64 KB L1d: 64 KB L2: 3 MB[205] |
3× cores[205] | LP-DDR4[205] | December 14, 2017 |
| |
Name | Model no. | Image | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | GPU | Memory bandwidth | First Released | Utilizing devices |
Memory technology |
U series
The Apple "U" series is a family of systems in a package (SiP) implementing ultra-wideband radio.
Apple U1
The Apple U1 is used in the iPhone 11 series and later (excluding the second and third generation iPhone SE), Apple Watch Series 6 and newer, HomePod Mini, AirTag trackers and the charging case for AirPods Pro (2nd generation).[206]
List of processors
Name | Model no. | Image | CPU | Semiconductor technology | First Released | Utilizing devices |
---|---|---|---|---|---|---|
U1 | TMK
A75 |
Cortex-M4 ARMv7E-M[208] |
16 nm FinFET (TSMC 16FF) |
September 20, 2019 |
| |
Name | Model no. | Image | CPU | Semiconductor technology | First Released | Utilizing devices |
W series
The Apple "W" series is a family of SoCs and wireless chips with a focus on Bluetooth and Wi-Fi connectivity. "W" in model numbers stands for wireless.
Apple W1
The Apple W1 is a SoC used in the 2016 AirPods and select Beats headphones.[209][210] It maintains a Bluetooth[211] Class 1 connection with a computer device and decodes the audio stream that is sent to it.[212]
Apple W2
The Apple W2, used in the Apple Watch Series 3, is integrated into the Apple S3 SiP. Apple said the chip makes Wi-Fi 85% faster and allows Bluetooth and Wi-Fi to use half the power of the W1 implementation.[170]
Apple W3
The Apple W3 is used in the Apple Watch Series 4,[213] Series 5,[214] Series 6,[179] SE (1st generation),[179] Series 7, Series 8, SE (2nd generation), and Ultra. It is integrated into the Apple S4, S5, S6, S7 and S8 SiPs. It supports Bluetooth 5.0/5.3.
List of processors
Name | Model no. | Image | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | Memory technology | Bluetooth | First Released | Utilizing devices |
---|---|---|---|---|---|---|---|---|---|---|---|
Memory bandwidth | |||||||||||
W1 | 343S00130[215] 343S00131[215] |
TBC | 14.3 mm2 [215] |
TBC | 4.2 | December 13, 2016 |
| ||||
W2 | 338S00348[216] | TBC | September 22, 2017 |
||||||||
W3 | 338S00464[217] | 5.0 | September 21, 2018 |
||||||||
5.3 | |||||||||||
Name | Model no. | Image | Semiconductor technology | Die size | CPU ISA | CPU | CPU cache | Memory bandwidth | Bluetooth | First Released | Utilizing devices |
Memory technology |
Miscellaneous devices
This segment is about Apple-designed processors that are not easily sorted into another section.
Early series
Apple first used SoCs in early versions of the iPhone and iPod Touch. They combine in one package a single ARM-based processing core (CPU), a graphics processing unit (GPU), and other electronics necessary for mobile computing.
The APL0098 (also 8900B[218] or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007, at the launch of the original iPhone. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 90 nm process.[13] The iPhone 3G and the first-generation iPod Touch also use it.[219]
The APL0278[220] (also S5L8720) is a PoP SoC introduced on September 9, 2008, at the launch of the second-generation iPod Touch. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 65 nm process.[13][219]
The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It was manufactured by Samsung on a 65 nm process.[105]
The APL2298 (also S5L8922) is a 45 nm die shrunk version of the iPhone 3GS SoC[13] and was introduced on September 9, 2009, at the launch of the third-generation iPod Touch.
Other
The 339S0196 is an ARM-based microcontroller used in Apple's Lightning Digital AV Adapter, a Lightning-to-HDMI adapter. This is a miniature computer with 256 MB RAM, running an XNU kernel loaded from the connected iOS device, then taking a serial signal from the iOS device translating that into a proper HDMI signal.[221][222]
Model no. | Image | First released | CPU ISA | Specs | Application | Utilizing devices | Operating system |
---|---|---|---|---|---|---|---|
339S0196 | September 2012 | Unknown | 256 MB RAM |
Lightning to HDMI conversion |
Apple Digital AV Adapter |
XNU | |
Model no. | Image | First released | CPU ISA | Specs | Application | Utilizing devices | Operating system |
See also
- Apple motion coprocessors
- ARM Cortex-A9 MPCore
- List of iOS and iPadOS devices
- List of Macintosh models grouped by CPU type
- List of Samsung platforms (SoCs):
- Exynos (none have been used by Apple)
- historical (some were used in Apple products)
- PowerVR SGX GPUs were also used in the iPhone 3GS and the third-generation iPod Touch
- PWRficient, a processor designed by P.A. Semi, a company Apple acquired to form an in-house custom chip design department
Similar platforms
- A31 by AllWinner
- Atom by Intel
- BCM2xxxx by Broadcom
- eMAG and Altra by Ampere Computing
- Exynos by Samsung
- i.MX by Freescale Semiconductor
- Jaguar and Puma by AMD
- Kirin by HiSilicon
- MTxxxx by MediaTek
- NovaThor by ST-Ericsson
- OMAP by Texas Instruments
- RK3xxx by Rockchip
- Snapdragon by Qualcomm
- Tegra by Nvidia
Notes
- ^ Could be referred to as "A1" though it is not labelled as such
- ^ iPhone (1st generation) and iPod touch (1st generation)
- ^ iPhone 3G and iPod touch (2nd generaiton)
- ^ Could be referred to as "A2" though it is not labelled as such
- ^ Sometimes referred to as "A3" though it is not labelled as such
- ^ iPad (1st generation)
- ^ iPod touch (5th generation), iPad 2 (Wi-Fi), iPad (3rd generation, Wi-Fi), iPad mini (1st generation, Wi-Fi)
- ^ iPhone 4S, iPad 2 (Wi-Fi + Cellular), iPad (3rd generation, Wi-Fi + Cellular), iPad mini (1st generation, Wi-Fi + Cellular)
- ^ iPhone 5C and iPad (4th generation, Wi-Fi)
- ^ iPhone 5 and iPad (4th generation, Wi-Fi + Cellular)
- ^ iPad Pro 12.9-inch (5th generation) with 1 TB and 2 TB storage, iPad Pro 11-inch (3rd generation) with 1 TB and 2 TB storage, online configured MacBook Air (M1) and online configured MacBook Pro 13-inch (M1)
- ^ Except iPad Air (5th generation)
- ^ Except iPad Air (5th generation)
- ^ Except iPad Air (5th generation) which only contains 1 USB-C
- ^ Online configured MacBook Pro 14-inch (2021) and online configured MacBook Pro 16-inch (2021)
- ^ Online configured MacBook Pro 14-inch (2021), online configured MacBook Pro 16-inch (2021) and online configured Mac Studio
- ^ Online configured Mac Studio
- ^ Online configured MacBook Air (M2) and online configured MacBook Pro 13-inch (M2)
- ^ Online configured MacBook Air (M2) and online configured MacBook Pro 13-inch (M2)
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Further reading
- Gurman, Mark (January 29, 2018). "How Apple Built a Chip Powerhouse to Threaten Qualcomm and Intel". Bloomberg Businessweek.