AMD mobile platform

The AMD mobile platform is an open platform for laptops from AMD. Though little marketing was done on this platform, it has been competing with the Centrino platform in the segment to gain more marketshare.

Implementations

Initial platform

Launched in 2003, the initial platform for mobile AMD processors consists of:

• Processors - Socket 754
  • Mobile Sempron single-core 32-bit processor (codenamed Dublin, Sonora, Roma), or
  • Mobile Athlon 64 single-core 64-bit processor (codenamed ClawHammer, Odessa, Oakville), or
  • Turion 64 single-core 64-bit processor (codenamed Lancaster); and
• D-sub and HyperTransport 1.0 support

Kite platform

Introduced in 2006, the Kite platform consists of:

• Processors - Socket S1
  • Mobile Sempron single-core 64-bit processor (codenamed Keene), or
  • Turion 64 single-core 64-bit processor (codenamed Richmond), or
  • Turion 64 X2 dual-core 64-bit processor (codenamed Taylor, Trinidad); and
• Wireless IEEE 802.11 a/b/g mini-PCIe WiFi adapter; and
• DDR2-800 SO-DIMM; and
• DVI and HyperTransport 1.0 support

Kite Refresh platform

AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

The Kite Refresh platform consists of:

• Processors - Socket S1
  • Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm (codenamed Tyler), or
  • Mobile Sempron single-core 64-bit processor 65nm (codenamed Sherman); and
• Wireless IEEE 802.11 a/b/g/draft-N support, mini-PCIe Wi-Fi adapter; and
• DDR2-800 SO-DIMM; and
• Hybrid hard drives support; and
• HDMI, HyperTransport 1.0 and PCI Express 1.0 support
• Alert Standard Format (ASF) 2.0 support (ASF page)
• Trusted Platform Module (TPM) support

Puma platform

Template:Future chip The Puma platform to be introduced in 2008 for the third-generation AMD mobile platform consists of:

• Processors
  • Turion 64 X2 dual-core 64-bit Griffin family processor (codenamed Lion), or
  • Mobile Sempron single-core 64-bit processor (codenamed Sable), with the followings:
    • Split-power planes and linked power management support and
    • Support for possible low voltage processors; and
• Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter; and
• PowerXpress - Dynamic switching between integrated & discrete graphics; and
• DDR2-800 SO-DIMM; and
• Hybrid hard drives support; and
• HyperFlash - memory modules on motherboard with ReadyBoost support; and
• DisplayPort, HyperTransport 3.0 and PCI Express 2.0 support
• Desktop and mobile Architecture for System Hardware (DASH) 1.0 support (DASH page)
• Trusted Platform Module (TPM) support

Shrike platform

Template:Future chip To be introduced in 2009, the Shrike platform supports:

• Upcoming generation processor based on the Fusion project, codenamed Swift, including:
  • made on 45 nm process for the whole processor
  • DDR3 SO-DIMM support
  • Socket FS1
  • quad-core processor support,
  • one full DirectX compliant GPU core in processor comparable to current high-end video cards,
  • Unified Video Decoder (UVD); and
• New mobile GPU core codenamed M90 family (presumably the Radeon R800 generation).
• Hybrid hard drives support; and
• HyperFlash - memory modules on motherboard with ReadyBoost support; and
• DisplayPort
• Desktop and mobile Architecture for System Hardware (DASH) 1.0 support
• Trusted Platform Module (TPM) support
• Ultra-wideband (UWB) support

Open platform approach

On February 2007, AMD had announced the "Better by Design" initiative to continue the success of the open platform approach for desktop back in early 2003 after the launch of Athlon 64 processors with a lack of chipset being developed by AMD, and open the platform to chipset vendors such as VIA, SiS, NVIDIA and ATI. The initiative also includes platforms succeeding the Kite Refresh mobile platform.

File:Better by Design Sticker -1.png

"Better Dual-core" class sticker example

Under the "Better by Design" initiative, AMD introduced a three-cell arrow sticker to identify mobile platform products, which the top cell being the processor (as Turion 64 X2). The middle cell for graphics accelerators as NVIDIA or ATI (as a result of retaining the use of "ATI Radeon" branding for graphics ), including onboard graphics (IGP), while the last cell representing the wireless (Wi-fi, IEEE 802.11 standard) or LAN solutions, provided by one of the following companies: Airgo, Atheros, Broadcom, Marvell, Qualcomm, and Realtek.

The stickers to be used will be further classified by the system performance according to the processor performance, and into five classes, each having different colours as well as different logos for each component, listed as follows:

Class	Processor	Sticker		Related brands	Other components
		Border	Background
Good Single-core	Mobile Sempron	grey	white	none	Graphics: ATI (Mobility Radeon/Radeon Xpress), NVIDIA (GeForce/nForce IGP) Wireless connectivity and management: Broadcom, Atheros, Airgo, Marvell, Realtek
Good Dual-core	Athlon X2	grey	white
Better Dual-core	Turion 64 X2	Silver	Silver
Best Dual-core	Turion 64 X2	Gold	Gold
Best Dual-core for digital media	Turion 64 X2	?	?	AMD Live!
Unknown Puma	Turion Ultra	Silver	Black	none

Market analysis

According to AMD figures in December 2007, AMD mobile platform gained 19% unit share in the market and about 23% revenue share of the firm during Q3 2007 while competing with the Intel Centrino platform. Figures for Q1 and Q2 2007 are 15% and 17% unit share, accounting for 14% and 16% of the company's revenue respectively.

See also

• Turion 64
• Turion 64 X2
• List of AMD Turion microprocessors
• List of AMD Sempron microprocessors
• List of AMD Athlon 64 microprocessors
• Centrino

External links

• AMD Better by Design page
• TGDaily: AMD announces details of next-gen mobile processor "Griffin"
• The Inquirer: AMD Bulldozer to demolish Intel Santa Rosa
• AMD mobile platform rodamap from AMD Analyst day presentations, slide 29
• AMD Better by Design event presentation