Micro Leadframe Package: Difference between revisions
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[[Image:28 pin MLP integrated circuit.jpg|thumb|200px|right|MLP package 28-pin chip, upside down to show contacts]] |
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[[pt:Micro Leadframe Package]] |
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Revision as of 06:12, 17 December 2009
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Micro Leadframe Package (MLP) is a family of integrated circuit QFN packages, used in surface mounted electronic circuits designs. It is available in 3 versions which are MLPQ (Q stands for Quad), MLPM (M stands for Micro) and MLPD (D stands for Dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to Chip Scale Packages (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for Small-outline integrated circuit (SOIC) packages.
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