Micro Leadframe Package: Difference between revisions
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{{Unreferenced stub|auto=yes|date=December 2009}} |
{{Unreferenced stub|auto=yes|date=December 2009}} |
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{{Mergeto|QFN|date=August 2009}} |
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[[Image:28 pin MLP integrated circuit.jpg|thumb|200px|right|MLP package 28-pin chip, upside down to show contacts]] |
[[Image:28 pin MLP integrated circuit.jpg|thumb|200px|right|MLP package 28-pin chip, upside down to show contacts]] |
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'''Micro Leadframe Package''' (MLP) is a family of [[integrated circuit]] [[QFN]] packages, used in [[Surface mount technology|surface mounted]] [[Electronics|electronic]] circuits designs. It is available in 3 versions which are MLPQ (Q stands for Quad), MLPM (M stands for Micro) and MLPD (D stands for Dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to [[Chip Scale Package]]s (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for [[Small-outline integrated circuit]] (SOIC) packages. |
'''Micro Leadframe Package''' (MLP) is a family of [[integrated circuit]] [[QFN]] packages, used in [[Surface mount technology|surface mounted]] [[Electronics|electronic]] circuits designs. It is available in 3 versions which are MLPQ (Q stands for Quad), MLPM (M stands for Micro) and MLPD (D stands for Dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to [[Chip Scale Package]]s (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for [[Small-outline integrated circuit]] (SOIC) packages. |
Revision as of 10:45, 5 February 2010
Micro Leadframe Package (MLP) is a family of integrated circuit QFN packages, used in surface mounted electronic circuits designs. It is available in 3 versions which are MLPQ (Q stands for Quad), MLPM (M stands for Micro) and MLPD (D stands for Dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to Chip Scale Packages (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for Small-outline integrated circuit (SOIC) packages.