Micro Leadframe Package: Difference between revisions
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MLP is a family of [[QFN]] packages, used in [[Surface mount technology|surface mounted]] [[Electronics|electronic]] circuits designs. It is available in 3 versions which are MLPQ (Q stand for Quad), MLPM ( Mstands for Micro) and MLPD (dual). These package generally have exposed die attach pad to improve thermal performance. This package is near about CSP packages in construction. MLPD are designed to provide a footprint compatible replacement for SOIC packages. |
MLP is a family of [[QFN]] packages, used in [[Surface mount technology|surface mounted]] [[Electronics|electronic]] circuits designs. It is available in 3 versions which are MLPQ (Q stand for Quad), MLPM ( Mstands for Micro) and MLPD (dual). These package generally have exposed die attach pad to improve thermal performance. This package is near about CSP packages in construction. MLPD are designed to provide a footprint compatible replacement for SOIC packages. |
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[[Category:Chip carriers]] |
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Revision as of 07:26, 22 June 2006
MLP is a family of QFN packages, used in surface mounted electronic circuits designs. It is available in 3 versions which are MLPQ (Q stand for Quad), MLPM ( Mstands for Micro) and MLPD (dual). These package generally have exposed die attach pad to improve thermal performance. This package is near about CSP packages in construction. MLPD are designed to provide a footprint compatible replacement for SOIC packages.