Jump to content

HiSilicon: Difference between revisions

From Wikipedia, the free encyclopedia
Content deleted Content added
No edit summary
No edit summary
Line 14: Line 14:
{{Chinese
{{Chinese
|s = 海思半导体有限公司
|s = 海思半导体有限公司
|t = 海思半導體有限公司
|p = Hǎisī Bàndǎotǐ Yǒuxiàn Gōngsī
|p = Hǎisī Bàndǎotǐ Yǒuxiàn Gōngsī
|l = Sea-Thinking Semiconductor Limited Company
|l = Sea-Thinking Semiconductor Limited Company

Revision as of 18:21, 20 August 2014

Ingenic Semiconductor Co., Ltd.
海思半导体有限公司
Company typeSubsidiary
HiSilicon
IndustryFabless semiconductors, Semiconductors, Integrated circuit design
HeadquartersShenzhen, China
ProductsSoCs
ParentHuawei
Websitewww.hisilicon.com
HiSilicon
Traditional Chinese海思半導體有限公司
Simplified Chinese海思半导体有限公司
Literal meaningSea-Thinking Semiconductor Limited Company
Transcriptions
Standard Mandarin
Hanyu PinyinHǎisī Bàndǎotǐ Yǒuxiàn Gōngsī

HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a fabless semiconductor company based in Shenzhen, PRC and fully owned by Huawei.

HiSilicon purchased licenses from ARM Holdings for at least ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[1][2] ARM Cortex-A53, and ARM Cortex-A57 and also for the Mali-T628 MP4.[3][4]

HiSilicon also purchased licenses from Vivante Corporation for their GC4000 graphics core,

HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[5]

Products

K3V1

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (MHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V1 (Hi3611) 130 nm ARMv5 ARM9E 1 800 2009 Babiken Vefone V1, Ciphone 5 (C5), T5355, IHTC HD-2, 5-inch Huawei UMPC

K3V2

The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[6] and Huawei MediaPad 10 FHD7 tablets.[7] This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[8] The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2 (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 480 MHz, 30.7 GFLOPS LPDDR2 64-bit dual-channel 7.2 (up to 8.5) 2012 Huawei MediaPad 10 FHD, Huawei Ascend D2 (U9510), Huawei Honor 2 (U9508), Huawei Ascend P6S, Huawei Ascend P2, Huawei Ascend Mate, Lenovo A376, STREAM X (GSL07S)

K3V2E

This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2E 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 480 MHz, 30.7 GFLOPS LPDDR2 64-bit dual-channel 7.2 (up to 8.5) 2013 Huawei Honor 3

KIRIN 910

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
KIRIN 910 28 nm HPM ARMv7 Cortex-A9 4 1.6 ARM Mali-450 MP4 533 MHz LPDDR3 32-bit single-channel 6.4 LTE Cat.4 H1 2014 Huawei MediaPad X1,[9] Huawei P6 S,[10] Huawei MediaPad M1[11]
KIRIN 910T 1.8 LPDDR3 32-bit single-channel 6.4 LTE Cat.4 H1 2014 Huawei Ascend P7

KIRIN 920

• The KIRIN 920 SoC also contains an image processor what supports up to 32 Megapixel

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
KIRIN 920 28 nm HPM ARMv7


Cortex-A15
Cortex-A7
big.LITTLE
4+4 1.7-2 GHz (A15)
1.3-1.6 GHz (A7)
Mali-T628 MP4 600 MHz LPDDR3 64-bit dual-channel 14.9 LTE Cat.6 H2 2014 Huawei Honor 6[12]

Similar platforms

References

  1. ^ HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, 02 August 2011 on ARM.com
  2. ^ "HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Retrieved 26 April 2013.
  3. ^ ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors on ARM.com
  4. ^ Lai, Richard. "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15". Engadget. Retrieved 26 April 2013.
  5. ^ "Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Retrieved 26 April 2013.
  6. ^ brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked on ARMdevices.net
  7. ^ Huawei introduces quad-core 10 inch tablet with 1080p display on Liliputing.com
  8. ^ Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate on Anandtech
  9. ^ "Huawei MediaPad X1". DeviceSpecifications. Retrieved 14 March 2014.
  10. ^ "Huawei P6 S". Huawei. Retrieved 12 June 2014.
  11. ^ "Huawei MediaPad M1". DeviceSpecifications. Retrieved 14 March 2014.
  12. ^ "Huawei Honor 6". DeviceSpecifications. Retrieved 25 June 2014.