HiSilicon: Difference between revisions
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{{Chinese |
{{Chinese |
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|s = 海思半导体有限公司 |
|s = 海思半导体有限公司 |
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|t = 海思半導體有限公司 |
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|p = Hǎisī Bàndǎotǐ Yǒuxiàn Gōngsī |
|p = Hǎisī Bàndǎotǐ Yǒuxiàn Gōngsī |
||
|l = Sea-Thinking Semiconductor Limited Company |
|l = Sea-Thinking Semiconductor Limited Company |
Revision as of 18:21, 20 August 2014
File:HiSilicon logo.jpg | |
Company type | Subsidiary |
---|---|
HiSilicon | |
Industry | Fabless semiconductors, Semiconductors, Integrated circuit design |
Headquarters | Shenzhen, China |
Products | SoCs |
Parent | Huawei |
Website | www |
HiSilicon | |||||||
---|---|---|---|---|---|---|---|
Traditional Chinese | 海思半導體有限公司 | ||||||
Simplified Chinese | 海思半导体有限公司 | ||||||
Literal meaning | Sea-Thinking Semiconductor Limited Company | ||||||
|
HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a fabless semiconductor company based in Shenzhen, PRC and fully owned by Huawei.
HiSilicon purchased licenses from ARM Holdings for at least ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[1][2] ARM Cortex-A53, and ARM Cortex-A57 and also for the Mali-T628 MP4.[3][4]
HiSilicon also purchased licenses from Vivante Corporation for their GC4000 graphics core,
HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[5]
Products
K3V1
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (MHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V1 (Hi3611) | 130 nm | ARMv5 | ARM9E | 1 | 800 | 2009 | Babiken Vefone V1, Ciphone 5 (C5), T5355, IHTC HD-2, 5-inch Huawei UMPC |
K3V2
The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[6] and Huawei MediaPad 10 FHD7 tablets.[7] This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[8] The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V2 (Hi3620) | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 480 MHz, 30.7 GFLOPS | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | — | — | — | — | 2012 | Huawei MediaPad 10 FHD, Huawei Ascend D2 (U9510), Huawei Honor 2 (U9508), Huawei Ascend P6S, Huawei Ascend P2, Huawei Ascend Mate, Lenovo A376, STREAM X (GSL07S) |
K3V2E
This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V2E | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 480 MHz, 30.7 GFLOPS | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | — | — | — | — | 2013 | Huawei Honor 3 |
KIRIN 910
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
KIRIN 910 | 28 nm HPM | ARMv7 | Cortex-A9 | 4 | 1.6 | ARM Mali-450 MP4 | 533 MHz | LPDDR3 | 32-bit single-channel | 6.4 | — | LTE Cat.4 | — | — | H1 2014 | Huawei MediaPad X1,[9] Huawei P6 S,[10] Huawei MediaPad M1[11] |
KIRIN 910T | 1.8 | LPDDR3 | 32-bit single-channel | 6.4 | — | LTE Cat.4 | — | — | H1 2014 | Huawei Ascend P7 |
KIRIN 920
• The KIRIN 920 SoC also contains an image processor what supports up to 32 Megapixel
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
KIRIN 920 | 28 nm HPM | ARMv7
|
Cortex-A15 Cortex-A7 big.LITTLE |
4+4 | 1.7-2 GHz (A15) 1.3-1.6 GHz (A7) |
Mali-T628 MP4 | 600 MHz | LPDDR3 | 64-bit dual-channel | 14.9 | — | LTE Cat.6 | — | — | H2 2014 | Huawei Honor 6[12] |
Similar platforms
- R-Car by Renesas
- Tegra by Nvidia
- OMAP by Texas Instruments
- Exynos by Samsung
- Snapdragon by Qualcomm
- Ax by Apple
- Atom by Intel
- i.MX by Freescale Semiconductor
- RK3xxx by Rockchip
- Allwinner Axy by AllWinner
- MTxxxx by MediaTek
References
- ^ HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, 02 August 2011 on ARM.com
- ^ "HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Retrieved 26 April 2013.
- ^ ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors on ARM.com
- ^ Lai, Richard. "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15". Engadget. Retrieved 26 April 2013.
- ^ "Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Retrieved 26 April 2013.
- ^ brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked on ARMdevices.net
- ^ Huawei introduces quad-core 10 inch tablet with 1080p display on Liliputing.com
- ^ Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate on Anandtech
- ^ "Huawei MediaPad X1". DeviceSpecifications. Retrieved 14 March 2014.
- ^ "Huawei P6 S". Huawei. Retrieved 12 June 2014.
- ^ "Huawei MediaPad M1". DeviceSpecifications. Retrieved 14 March 2014.
- ^ "Huawei Honor 6". DeviceSpecifications. Retrieved 25 June 2014.