HiSilicon: Difference between revisions
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=== KIRIN 620 === |
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• supports - USB2 / 13MP / 1080P Video Encode |
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{| class="wikitable" |
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|- |
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! rowspan="2" | Model Number |
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! rowspan="2" | [[Semiconductor device fabrication|Fab]] |
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! colspan="4" | [[Central processing unit|CPU]] |
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! colspan="2" | GPU |
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! colspan="3" | Memory Technology |
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! rowspan="2" | [[Satellite navigation|Nav]] |
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! colspan="3" | wireless |
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! rowspan="2" | Sampling Availability |
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! rowspan="2" | Utilizing Devices |
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|- |
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! [[Instruction set]] |
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! [[Microarchitecture]] |
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! Cores |
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! Frq (GHz) |
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! [[Microarchitecture]] |
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! Frq (MHz) |
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! Type |
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! Bus width ([[bit]]) |
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! [[List of device bit rates#Dynamic random access memory|Bandwidth]] ([[Gigabyte|GB]]/s) |
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! [[Template:Cellular network standards|Cellular]] |
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! [[Wireless LAN|WLAN]] |
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! [[Personal area network|PAN]] |
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|- |
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| KIRIN 620 |
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| 28 nm |
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| ARMv8-A |
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| [[ARM Cortex-A53|Cortex-A53]] |
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| 8 |
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| 1.2 GHz (A53) |
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| Mali-T450 MP4 |
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| |
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| [[LPDDR3]] ( MHz) || 64-bit dual-channel || 12.8 |
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| {{N/A}} |
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| DUAL SIM LTE Cat.4 (150Mbit/s)|| {{N/A}} || {{N/A}} |
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| Q1 2015 |
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| {{Collapsible list |
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| [[Huawei P8 Lite, Huawei X4]] |
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=== KIRIN 910 === |
=== KIRIN 910 === |
Revision as of 10:57, 15 April 2015
File:HiSilicon logo.jpg | |
Native name | 海思半导体有限公司 |
---|---|
Company type | Subsidiary |
HiSilicon | |
Industry | Fabless semiconductors, Semiconductors, Integrated circuit design |
Headquarters | Shenzhen, Guangdong, China |
Products | SoCs |
Parent | Huawei |
Website | www |
HiSilicon | |||||||
---|---|---|---|---|---|---|---|
Simplified Chinese | 海思半导体有限公司 | ||||||
Traditional Chinese | 海思半導體有限公司 | ||||||
Literal meaning | Haisi Semiconductor Limited Company | ||||||
|
HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a fabless semiconductor company based in Shenzhen, China and fully owned by Huawei.
HiSilicon purchased licenses from ARM Holdings for at least ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[1][2] ARM Cortex-A53, and ARM Cortex-A57 and also for the Mali-T628 MP4.[3][4]
HiSilicon also purchased licenses from Vivante Corporation for their GC4000 graphics core,
HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[5]
Products
K3V1
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (MHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V1 (Hi3611) | 130 nm | ARMv5 | ARM9E | 1 | 800 | 2009 | List
|
K3V2
The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[6] and Huawei MediaPad 10 FHD7 tablets.[7] This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[8] The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V2 (Hi3620) | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 480 MHz, 30.7 GFLOPS | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | — | — | — | — | 2012 |
K3V2E
This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
K3V2E | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 480 MHz, 30.7 GFLOPS | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | — | — | — | — | 2013 | List |
KIRIN 620
• supports - USB2 / 13MP / 1080P Video Encode
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
KIRIN 620 | 28 nm | ARMv8-A | Cortex-A53 | 8 | 1.2 GHz (A53) | Mali-T450 MP4 | LPDDR3 ( MHz) | 64-bit dual-channel | 12.8 | — | DUAL SIM LTE Cat.4 (150Mbit/s) | — | — | Q1 2015 |
KIRIN 910
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
KIRIN 910 | 28 nm HPM | ARMv7 | Cortex-A9 | 4 | 1.6 | ARM Mali-450 MP4 | 533 MHz | LPDDR3 | 32-bit single-channel | 6.4 | — | LTE Cat.4 | — | — | H1 2014 | |
KIRIN 910T | 1.8 | 700 MHz | LPDDR3 | 32-bit single-channel | 6.4 | — | LTE Cat.4 | — | — | H1 2014 | List
|
KIRIN 920
• The KIRIN 920 SoC also contains an image processor that supports up to 32 Megapixel
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
KIRIN 920 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE |
4+4 | 1.7 GHz (A15) 1.3 GHz (A7) |
Mali-T624 MP4 | 600 MHz[citation needed] | LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | — | LTE Cat.6 (300Mbit/s) | — | — | H2 2014 | List |
KIRIN 925 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE |
4+4 | 1.8 GHz (A15) 1.3 GHz (A7) |
Mali-T628 MP4 | LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | — | LTE Cat.6 (300Mbit/s) | — | — | Q3 2014 | List
|
KIRIN 930
• supports - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-Band a/b/g/n WI_FI / BT 4.0 Low Energy / USB2 / 32MP ISP / 1080P Video Encode
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
KIRIN 930 | 28 nm HPM | ARMv8-A | Cortex-A53e Cortex-A53 big.LITTLE |
4+4 | 2.0 GHz (A53e) 1.5 GHz (A53) |
Mali-T628 MP4 | LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | — | DUAL SIM LTE Cat.6 (301.5Mbit/s) | — | — | Q1 2015 | List |
KIRIN 940
• supports - SD 4.1(UHS-II) / eMMC 5.1 / UFS 2.0 Memory / MU-MIMO ac WI_FI / BT 4.2 smart / USB3 / NFC / Dual ISP (32MP) / 4K Video Encode
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
KIRIN 940 | 16 nm HPM | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE |
4+4 | 2.2 GHz (A72) 1.5 GHz (A53) |
Mali-T860 MP4 | LPDDR4 (?? MHz) | 64-bit dual-channel | 25.6 | — | DUAL SIM LTE Cat.7 (301.5Mbit/s) | — | — | Q3 2015 |
|
KIRIN 950
• supports - SD 4.1(UHS-II) / eMMC 5.1 / UFS 2.0 Memory / MU-MIMO ac WI_FI / BT 4.2 smart / USB3 / NFC / Dual ISP (42MP) / 4K Video Encode
Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
KIRIN 950 | 16 nm HPM | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE |
4+4 | 2.4 GHz (A72) 1.5 GHz (A53) |
Mali-T880 MP4 | LPDDR4 (?? MHz) | 64-bit dual-channel | 25.6 | — | DUAL SIM LTE Cat.10 (452.2Mbit/s) | — | — | Q4 2015 |
Similar platforms
- R-Car by Renesas
- Tegra by Nvidia
- OMAP by Texas Instruments
- Exynos by Samsung
- Snapdragon by Qualcomm
- Ax by Apple
- Atom by Intel
- i.MX by Freescale Semiconductor
- RK3xxx by Rockchip
- Allwinner Axy by AllWinner
- MTxxxx by MediaTek
References
- ^ HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications, 02 August 2011 on ARM.com
- ^ "HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Retrieved 26 April 2013.
- ^ ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors on ARM.com
- ^ Lai, Richard. "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15". Engadget. Retrieved 26 April 2013.
- ^ "Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Retrieved 26 April 2013.
- ^ brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked on ARMdevices.net
- ^ Huawei introduces quad-core 10 inch tablet with 1080p display on Liliputing.com
- ^ Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate on Anandtech
- ^ "Huawei MediaPad X1". DeviceSpecifications. Retrieved 14 March 2014.
- ^ "Huawei P6 S". Huawei. Retrieved 12 June 2014.
- ^ "Huawei MediaPad M1". DeviceSpecifications. Retrieved 14 March 2014.
- ^ "Huawei Honor 6". DeviceSpecifications. Retrieved 25 June 2014.