User talk:Davidotsu

Here is a snippet of my unique qualifications for the two projects you mentioned earlier:

General (Applicable to Both Tasks) A key component of a successful qualification is the scientific, engineering, and statistical foundation of its experimental design. The scientist identifies the critical factors, associated responses, and repeatable measurement methodologies based on theories and anecdotal evidence. The engineer ensures the experiment pertains to the application at hand, tests in suites to make informed adjustments to the plan (as opposed to all-at-once), and troubleshoots issues before they arise. The statistician guarantees the resultant main effects and interactions are clear with sound experimental design (factorial, replicates, etc) and rigorous statistical controls (meeting assumptions, controlling bias, randomization). My participation on various NG qualifications (Ti EBM, FM-410, AC-130) and research initiatives in academia has given me a solid background in all three of these perspectives. This, along with my soft skills (communication, presentations, timely delivery of results, polish), should prove to be invaluable to either effort.

Solder Task My technical experience with soldering can be split into theory and application. On the theory side, I have a solid understanding of fundamental parameters key to forming a successful joint, such as cleanliness/wettability, joint configuration (gap distance), solder/flux form and chemistry, and transient heating characteristics. This knowledge base has allowed me to facilitate various research initiatives, such as identifying the mechanisms of brittle solder joint formation in the ENEPIG process. In application, I’ve used this knowledge to identify defects (peeling, inclusions, voids, intermetallics, etc) in cross-sectional analysis of experimental solder joints using optical microscopy and SEM/EDX. My knowledge base was also applied to perform a rapid RCA on a leaking pipe joint (which was eventually determined to be a combination of the large gap distance, solidification shrinkage, and improper flux removal leading to extensive in-situ corrosion). For this reason, I believe I am well suited to assist Roger with his soldering task.

Plating Task In general, my plating knowledge outside of pre-soldering applications is fairly limited. Therefore, this task would be an excellent opportunity to lay the technical foundation for a ubiquitous and essential process.

I would be happy to work on either of these tasks. However, I believe my technical background and personal interests are better aligned with the soldering task. I hope this write-up will help you make an informed decision. Please let me know if you have any questions.