User contributions for Jknechtel
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A user with 18 edits. Account created on 22 June 2011.
4 June 2018
- 09:2109:21, 4 June 2018 diff hist −71 Nelsons Island Undid revision 844218625 by 51.175.215.113 (talk) -- the reverted edit has no source provided, and is out of the original context (no habitation in previous centuries). Moreover, the best guess is that those people seen in Google Earth/Street View are those mapping the island for Google. Tag: Undo
2 June 2018
- 15:0215:02, 2 June 2018 diff hist +97 m Nelsons Island Fix URL street view
- 14:5714:57, 2 June 2018 diff hist +147 Nelsons Island Added example for debris from google street view Tags: Mobile edit Mobile web edit
22 August 2017
- 09:1909:19, 22 August 2017 diff hist +88 User talk:Dammitkevin →Through-silicon via
- 09:1809:18, 22 August 2017 diff hist +1,642 User talk:Dammitkevin →Through-silicon via
21 August 2017
- 21:0321:03, 21 August 2017 diff hist +25 N User:Jknechtel started userpage current
- 17:0217:02, 21 August 2017 diff hist +129 m Hardware backdoor Added link to hardware Trojans, another conceptionally similar form of backdoors Tag: Visual edit
- 16:5216:52, 21 August 2017 diff hist +900 User talk:Dammitkevin →Through-silicon via: new section
- 16:1916:19, 21 August 2017 diff hist +214 Hardware security No edit summary Tag: Visual edit
- 15:5915:59, 21 August 2017 diff hist +1,465 Through-silicon via Note that this classification is truthful and relevant. I've also added another reference for the well-known ITRS. Tag: Visual edit
- 15:4615:46, 21 August 2017 diff hist +2,092 Interposer Please note that interposer are considered by many experts as promising and cost-effective. Also note that I listed many different examples of actual products; removing this drops IMHO relevant material. I hope adding further references mitigates any bias Tag: Visual edit
- 15:2815:28, 21 August 2017 diff hist +691 m Hardware security Added two tutorial references from an IEEE special edition Tag: Visual edit
17 August 2017
- 09:3209:32, 17 August 2017 diff hist +1,791 Through-silicon via Added details of TSV flavors and manufacturing; extended discussion on TSVs going through FEOL; added recent references; minor edits wording Tag: Visual edit
- 09:0409:04, 17 August 2017 diff hist +1,072 Interposer Added interposer products as examples for market acceptance Tag: Visual edit
- 08:4708:47, 17 August 2017 diff hist +435 Three-dimensional integrated circuit Revised paragraph on circuit security; minor edits wording, added further discussion on hardware monitors for system-level security Tag: Visual edit
23 June 2011
- 10:0610:06, 23 June 2011 diff hist +1,435 Three-dimensional integrated circuit →First 3D processor: Added 3D designs by Intel; removed "the first"-qualifier for Rochester cube.
22 June 2011
- 15:4415:44, 22 June 2011 diff hist +3,539 Three-dimensional integrated circuit Added section on design styles for 3D ICs
- 12:3012:30, 22 June 2011 diff hist +2,207 Three-dimensional integrated circuit Added discussion of TSV-introduced overhead and testing to section on challenges